LM3535TMX/NOPB - Texas Instruments

LM3535

D1A

D2AD3AD4A D53

I2C

Control

Signals

D1B/

INT

SDIO

1µF

1µF 1µF

1µF GND

D62

C1+

C1-

C2+

C2- SCL

D1C/

ALS

HWEN

GROUP A

GROUP B GROUP C

PWM

VIO

VIN VOUT

Product

Folder

Order

Now

Technical

Documents

Tools &

Software

Support &

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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

LM3535

SNVS598B –AUGUST 2010–REVISED MARCH 2018

LM3535 Multi-Display LED Driver With Ambient Light Sensing and Dynamic

Backlight Control Compatibility

1 Features

1• Drives Up to 8 LEDs Each With Up to 25 mA of

Diode Current

• External PWM Input for Dynamic Backlight Control

• Multi-Zone Ambient Light Sensing (ALS)

• ALS Interrupt Reporting

• Independent On/Off Control for All Current Sinks

• 128 Exponential Dimming Steps With 600:1

Dimming Ratio for Group A (Up to 6 LEDs)

• 8 Linear Dimming States for Groups B (Up to 3

LEDs) and D1C (1 LED)

• Programmable Auto-Dimming Function

• Up to 90% Efficiency

• 0.55% Accurate Current Matching

• Wide Input Voltage Range (2.7 V to 5.5 V)

• Active High Hardware Enable

• Total Solution Size < 16 mm2

• Low Profile 20-Pin DSBGA Package

2 Applications

• Smart-Phone LED Backlighting

• Large Format LCD Backlighting

• General LED Lighting

3 Description

The LM3535 device is a highly integrated LED driver

capable of driving 8 LEDs in parallel for large display

applications. Independent LED control allows

selection of a subset of the 6 main display LEDs for

partial-illumination applications. In addition to the

main bank of 6, the LM3535 is capable of driving an

additional 2 independently controlled LEDs to support

Indicator applications.

The LED driver current sinks are split into three

independently controlled groups. The primary group

can be configured to drive up to six LEDs for use in

the main phone display. Groups B and C are

provided for driving secondary displays, keypads and

indicator LEDs. All of the LED current sources can be

independently turned on and off providing flexibility to

address different application requirements.

The LM3535 provides multi-zone ambient light

sensing allowing autonomous backlight intensity

control in the event of changing ambient light

conditions. A PWM input is also provided to give the

user the means to adjust the backlight intensity

dynamically based upon the content of the display.

The LM3535 provides excellent efficiency without the

use of an inductor by operating the charge pump in a

gain of 3/2 or in pass mode. The proper gain for

maintaining current regulation is chosen, based on

LED forward voltage, so that efficiency is maximized

over the input voltage range.

The LM3535 is available in a tiny 20-pin, 0.4-mm

pitch, thin DSBGA package.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (MAX)

LM3535 DSBGA (20) 2.045 mm × 1.64 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

Typical Application

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Table of Contents

1 Features.................................................................. 1

2 Applications ........................................................... 1

3 Description............................................................. 1

4 Revision History..................................................... 2

5 Pin Configuration and Functions......................... 3

6 Specifications......................................................... 4

6.1 Absolute Maximum Ratings ...................................... 4

6.2 ESD Ratings.............................................................. 4

6.3 Recommended Operating Conditions....................... 4

6.4 Thermal Information.................................................. 5

6.5 Electrical Characteristics........................................... 5

6.6 Typical Characteristics.............................................. 7

7 Detailed Description............................................ 10

7.1 Overview................................................................. 10

7.2 Functional Block Diagram....................................... 10

7.3 Feature Description................................................. 11

7.4 Device Functional Modes........................................ 12

7.5 Programming........................................................... 12

8 Application and Implementation ........................ 19

8.1 Application Information............................................ 19

8.2 Typical Application ................................................. 19

9 Power Supply Recommendations...................... 28

10 Layout................................................................... 29

10.1 Layout Guidelines ................................................. 29

10.2 Layout Example .................................................... 29

11 Device and Documentation Support................. 30

11.1 Receiving Notification of Documentation Updates 30

11.2 Community Resources.......................................... 30

11.3 Trademarks........................................................... 30

11.4 Electrostatic Discharge Caution............................ 30

11.5 Glossary................................................................ 30

12 Mechanical, Packaging, and Orderable

Information........................................................... 30

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision A (May 2013) to Revision B Page

• Added Pin Configuration and Functions section, ESD Ratings table, Feature Description,Device Functional Modes,

Application and Implementation,Power Supply Recommendations ,Layout ,Device and Documentation Support ,

and Mechanical, Packaging, and Orderable Information ....................................................................................................... 1

• Deleted references to "ALS2" option ..................................................................................................................................... 1

• Changed ALS resistor accuracy values from –5% and 5% to –9% and 9% ......................................................................... 6

Changes from Original (May 2013) to Revision A Page

• Changed layout of National Data Sheet to TI format ........................................................................................................... 27

Top View

A B C D E

Bottom View

E D C B A

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5 Pin Configuration and Functions

YFQ Package

20-Pin DSBGA

Top View

Pin Functions

PIN TYPE DESCRIPTION

NO. NAME

A1, C1, B1, B2 C1+, C1–, C2+,

C2– Power Flying capacitor connections

A2 VOUT Power Charge pump output voltage

A3 VIN Power Input voltage; input range: 2.7 V to 5.5 V

A4 GND Power Ground

B3 D1B / INT Input /

Output LED driver/ ALS interrupt - GroupB current sink or ALS interrupt pin. In ALS Interrupt

mode, a pullup resistor is required. A zero (0) means a change has occurred, while

a one (1) means no ALS adjustment has been made.

B4, C4 D53, D62 Output LED drivers - configurable current sinks. Can be assigned to GroupA or GroupB

C2 SDIO Input /

Output Serial data input/output pin

C3 D1C / ALS Input /

Output LED driver / ALS input - indicator LED current sink or ambient light sensor input

D1 GND Power Ground

D2 PWM Input External PWM input - allows the current sinks to be turned on and off at a frequency

and duty cycle externally controlled. Minimum on-time pulse width = 15 µsec.

D3, E3, E4, D4 D1A-D4A Output LED drivers - GroupA

E1 HWEN Input Hardware enable pin. High = normal operation, Low = RESET

E2 SCL Input Serial clock pin

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(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltages are with respect to the potential at the GND pins.

(3) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and

specifications. All voltages are with respect to the potential at the GND pins.

(4) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ= 150°C (typical) and

disengages at TJ= 125°C (typical).

(5) For detailed soldering specifications and information, see Texas Instruments Application Report AN-1112 DSBGA Wafer Level Chip

Scale Package.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)(3)

MIN MAX UNIT

VIN pin voltage –0.3 6 V

SCL, SDIO, HWEN, PWM pin voltages –0.3 (VIN + 0.3 V) with 6 V

maximum V

IDxx pin voltages –0.3 (VVOUT + 0.3 V) with 6 V

maximum V

Continuous power dissipation(4) Internally limited

Junction temperature, tJ-MAX 150 °C

Maximum lead temperature (soldering) See(5) °C

Storage temperature, Tstg –65 150 °C

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) The human body model is a 100-pF capacitor discharged through a 1.5-kΩresistor into each pin. (MIL-STD-883 3015.7).

6.2 ESD Ratings VALUE UNIT

V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2) ±2000 V

(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Recommended Operating Ratings are

conditions under which operation of the device is ensured. Recommended Operating Ratings do not imply ensured performance limits.

For ensured performance limits and associated test conditions, see the Electrical Characteristics tables.

(2) All voltages are with respect to the potential at the GND pins.

(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

110°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the

device/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)(2)

MIN MAX UNIT

Input voltage 2.7 5.5 V

LED voltage 2 4 V

Junction temperature, TJ–30 110 °C

Ambient temperature, TA(3) –30 85 °C

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(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1) LM3535

UNITYFQ (WCSP)

20 PINS

RθJA Junction-to-ambient thermal resistance 70.5 °C/W

RθJC(top) Junction-to-case (top) thermal resistance 0.6 °C/W

RθJB Junction-to-board thermal resistance 16.7 °C/W

ψJT Junction-to-top characterization parameter 0.4 °C/W

ψJB Junction-to-board characterization parameter 16.9 °C/W

RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W

(1) All voltages are with respect to the potential at the GND pins.

(2) Minimum and maximum limits are ensured by design, test, or statistical analysis. Typical numbers are not ensured, but do represent the

most likely norm.

(3) CIN, CVOUT, C1, and C2: Low-ESR surface-mount ceramic capacitors (MLCCs) used in setting electrical characteristics

(4) For the two groups of current sinks on a part (GroupA and GroupB), the following are determined: the maximum sink current in the

group (MAX), the minimum sink current in the group (MIN), and the average sink current of the group (AVG). For each group, two

matching numbers are calculated: (MAX-AVG)/AVG and (AVG-MIN)/AVG. The largest number of the two (worst case) is considered the

matching figure for the Group. The matching figure for a given part is considered to be the highest matching figure of the two Groups.

The typical specification provided is the most likely norm of the matching figure for all parts.

(5) For each Dxxpin, headroom voltage is the voltage across the internal current sink connected to that pin. For Group A, B, and C current

sinks, VHRx = VOUT – VLED. If headroom voltage requirement is not met, LED current regulation will be compromised.

6.5 Electrical Characteristics

Typical limits are TA= 25°C, and minimum and maximum limits in apply over the full operating temperature range (–30°C to

+85°C). Unless otherwise specified: VIN = 3.6 V; VHWEN = VIN; VPWM = 0 V; VDxA = VDxB = VDxC = 0.4 V; GroupA = GroupB =

GroupC = full-scale current; ENxA, ENxB, ENxC bits = 1; 53A, 62A bits = 0; C1 = C2 = CIN = COUT= 1 µF.(1)(2)(3)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

IDxx

Output current regulation

GroupA

2.7 V ≤VIN ≤5.5 V

EN1A to EN4A = 1, 53A = 62A = 0, EN53

= EN62 = ENxB = ENxC = 0

4 LEDs in GroupA

23.6

(–5.6%) 25 26.3

(5.2%) mA

(%)

2.7 V ≤VIN ≤5.5 V

EN1A to EN4A = EN53 = EN62 = 1, 53A =

62A = 1, ENxB = ENxC = 0

6 LEDs in GroupA

23.2

(–7.2%) 25 26.3

5.2% mA

(%)

Output current regulation

GroupB

2.7 V ≤VIN ≤5.5 V

EN1B = EN53 = EN62 = 1, 53A = 62A = 0,

ENxA = ENC = 0

3 LEDs in GroupB

23.3

(–6.8%) 25 (+4%) mA

(%)

Output current regulation

IDC 2.7 V ≤VIN ≤5.5 V

ENC = 1, ENxA = ENxB = 0 23.8

(–4.8%) 25 26.8

(7.2%) mA

(%)

Output current regulation

GroupA, GroupB, and GroupC

enabled 3.2 V ≤VIN ≤5.5V

VLED = 3.6 V

DxA

DxB

DxC

IDxx-

MATCH LED current matching(4) 2.7 V ≤VIN ≤5.5 V

GroupA (4

LEDs) 0.25% 2.4%

GroupA (6

LEDs) 0.55% 2.78

GroupB (3

LEDs) 0.25% 2.41%

VDxTH VDxx 1x to 3/2x gain transition

threshold VDxA and/or VDxB falling 130 mV

VHR Current sink headroom voltage

requirement(5) IDxx = 95% ×IDxx (nominal)

(IDxx (nominal) = 25 mA) 100 mV

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Electrical Characteristics (continued)

Typical limits are TA= 25°C, and minimum and maximum limits in apply over the full operating temperature range (–30°C to

+85°C). Unless otherwise specified: VIN = 3.6 V; VHWEN = VIN; VPWM = 0 V; VDxA = VDxB = VDxC = 0.4 V; GroupA = GroupB =

GroupC = full-scale current; ENxA, ENxB, ENxC bits = 1; 53A, 62A bits = 0; C1 = C2 = CIN = COUT= 1 µF.(1)(2)(3)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

(6) SCL is tested with a 50% duty-cycle clock.

ROUT Open-loop charge pump output

resistance Gain = 3/2 2.4 Ω

Gain = 1 0.5

IQQuiescent supply current Gain = 3/2, no load 2.86 4.38 mA

Gain = 1, no load 1.09 2.31

ISB Standby supply current 2.7 V ≤VIN ≤5.5 V

HWEN = VIN, all ENx bits = 0 1.7 4 µA

ISD Shutdown supply current 2.7 V ≤VIN ≤5.5 V

HWEN = 0 V, All ENx bits = 0 1.7 4 µA

fSW Switching frequency 1.1 1.33 1.56 MHz

tSTART Start-up time VOUT = 90% steady state 250 µs

VALS ALS reference voltage accuracy 0.95

(–5%) 11.05

5% V

RALS ALS resistor accuracy RALS = 9.08 kΩ–9% 9%

RALS = 5.46 kΩ–9% 9%

VHWEN HWEN voltage thresholds 2.7 V ≤VIN ≤5.5 V Reset 0 0.45 V

Normal

operation 1.2 VIN

VPWM PWM voltage thresholds 2.7 V ≤VIN ≤5.5 V Diodes off 0 0.45 V

Diodes on 1.2 VIN

VOL-INT Interrupt output logic low 0 ILOAD = 3 mA 400 mV

I2C-COMPATIBLE INTERFACE VOLTAGE SPECIFICATIONS (SCL, SDIO)

VIL Input logic low 0 2.7 V ≤VIN ≤5.5 V 0 0.45 V

VIH Input logic high 1 2.7 V ≤VIN ≤5.5 V 1.2 VIN V

VOL SDIO output logic low 0 ILOAD = 3 mA 400 mV

I2C-COMPATIBLE INTERFACE TIMING SPECIFICATIONS (SCL, SDIO)

t1SCL (clock period) See(6) 2.5 µs

t2Data in setup time to SCL high 100 ns

t3Data out stable after SCL low 0 ns

t4SDIO low setup time to SCL low

(start) 100 ns

t5SDIO high hold time after SCL high

(stop) 100 ns

Figure 1. I2C Timing Diagram

VIN (V)

ISD (PA)

4.00

3.50

3.00

2.50

2.00

1.50

1.00

0.50

0.00

2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5

TA = -30°C, +25°C

TA = +85°C

VSCL = VSDIO = 0V

VIN (V)

fSW (MHz)

1.6

1.5

1.4

1.3

1.2

1.1

1.0

2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5

TA = +25°C

TA = -30°C

TA = +85°C

BRC (#)

IDX (mA)

00 16 32 48 64 80 96 112 128

TA = -30°C,+25°C and +85°C

BRC (#)

IDX (mA)

1.00e2

1.00e1

1.00

1.00e-1

1.00e-20 16 32 48 64 80 96 112 128

TA = -30°C,+25°C and +85°C

VIN (V)

IDx (mA)

27.5

27.0

26.5

26.0

25.5

25.0

24.5

24.0

23.5

23.0

22.52.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5

D4A

BRC = 127

D62

D1A,D2A,D3A,D53

VIN (V)

IDx (mA)

27.5

27.0

26.5

26.0

25.5

25.0

24.5

24.0

23.5

23.0

22.5

2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5

BRC = 127

TA= -30°C

TA= +85°C

TA= +25°C

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6.6 Typical Characteristics

Unless otherwise specified: TA= 25°C; VIN = 3.6 V; VHWEN = VIN; CIN= 1 µF, COUT = 1 µF, C1 = C2 = 1 µF.

Figure 2. ILED vs Input Voltage 6 LEDs Figure 3. ILED vs Input Voltage

Figure 4. ILED vs Brightness Code Linear Scale Figure 5. ILED vs Brightness Code Log Scale

Figure 6. Switching Frequency vs Input Voltage Tri-Temp Figure 7. Shutdown Current vs Input Voltage VIO = 0 V

D.C. (%)

ILEDx (mA)

0 20 40 60 80 100

fPWM = 250 Hz.

fPWM = 8 kHz.

fPWM = 20 kHz.

VIN (V)

IQ-3/2x (mA)

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5

TA = +25°C

TA = -30°C

TA = +85°C

VIN (V)

ISD (PA)

10.00

9.00

8.00

7.00

6.00

5.00

4.00

3.00

2.00

1.00

0.00

2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5

TA = +25°C

TA = -30°C

VSCL = VSDIO = 2.5V

TA = +85°C

VIN (V)

IQ-1x (mA)

2.00

1.75

1.50

1.25

1.00

0.75

0.50

0.25

0.00

2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5

TA = +25°C

TA = -30°C

TA = +85°C

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Typical Characteristics (continued)

Unless otherwise specified: TA= 25°C; VIN = 3.6 V; VHWEN = VIN; CIN= 1 µF, COUT = 1 µF, C1 = C2 = 1 µF.

Figure 8. Shutdown Current vs Input Voltage VIO = 2.5 V Figure 9. Quiescent Current vs Input Voltage 1× Gain

Figure 10. Quiescent Current vs Input Voltage 3/2× Gain Figure 11. ALS Boundary Voltage vs Boundary Code Falling

ALS Voltage

Figure 12. ALS Boundary Voltage vs Boundary Code Falling

ALS Voltage (Zoom) Figure 13. Diode Current vs PWM Duty Cycle

Time

(100 ms/div.)

VOUT

1V/div.

ILEDs

(20 mA/div.)

Time

(100 ms/div.)

VALS

200 mV/div.

ILEDs

(50 mA/div.)

INT

Time

(100 ms/div.)

VOUT

1V/div.

ILEDs

(20 mA/div.)

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Typical Characteristics (continued)

Unless otherwise specified: TA= 25°C; VIN = 3.6 V; VHWEN = VIN; CIN= 1 µF, COUT = 1 µF, C1 = C2 = 1 µF.

Figure 14. Ambient Light Sensor Response Figure 15. Diode Current Ramp-Up TSTEP = 6 ms

Figure 16. Diode Current Ramp-Down TSTEP = 6 ms

C1+ C1- C2+ C2-

1.25 V

Ref.

Soft

Start

1.3 MHz.

Switch

Frequency

VIN

LM3535

2.7V to 5.5V 3/2X and 1X

Regulated Charge Pump

GroupA Current Sinks

GroupB

Current

Sinks D1C Current

Sink

GAIN

CONTROL

Brightness

Control Brightness

Control

I2C Interface

Block

General Purpose Register

Brightness Control Registers

Group A and Group B

Brightness

Control

Brightness Control Register

D1C RSET

SDIO

SCL

D1A D2A D3A D4A D62 D1B/INT D1C/ALS

D53

CIN

HWEN

VOUT

PWM

COUT

1 PF

ALS

VIO

INT

1 PF 1 PF

GND

1 PF

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7 Detailed Description

7.1 Overview

The LM3535 is a white LED driver system based upon an adaptive 3/2× – 1× CMOS charge pump capable of

supplying up to 200 mA of total output current. With three separately controlled groups of constant current sinks,

the LM3535 is an ideal solution for platforms requiring a single white LED driver IC for main display, sub display,

and indicator lighting. The tightly matched current sinks ensure uniform brightness from the LEDs across the

entire small-format display.

Each LED is configured in a common anode configuration, with the peak drive current set to 25 mA. An I2C

compatible interface is used to enable the device and vary the brightness within the individual current sink

Groups. For GroupA, 128 exponentially-spaced analog brightness control levels are available. GroupB and

GroupC have 8 linearly-spaced analog brightness levels.

Additionally, the LM3535 provides 1 inputfor an ambient light sensor to adaptively adjust the diode current based

on ambient conditions, and a PWM pin to allow the diode current to be pulse width modulated to work with a

display driver utilizing dynamic or content adjusted backlight control (DBC or CABC).

7.2 Functional Block Diagram

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7.3 Feature Description

7.3.1 Charge Pump

The input to the 3/2× or 1× charge pump is connected to the VIN pin, and the regulated output of the charge

pump is connected to the VOUT pin. The recommended input voltage range of the LM3535 is 2.7 V to 5.5 V. The

device regulated charge pump has both open loop and closed loop modes of operation. When the device is in

open loop, the voltage at VOUT is equal to the gain times the voltage at the input. When the device is in closed

loop, the voltage at VOUT is regulated to 4.3 V (typical). The charge pump gain transitions are actively selected to

maintain regulation based on LED forward voltage and load requirements.

7.3.2 Diode Current Sinks

Matched currents are ensured with the use of tightly matched internal devices and internal mismatch cancellation

circuitry. There are eight regulated current sinks configurable into 3 different lighting regions.

7.3.3 Ambient Light Sensing (ALS) And Interrupt

The LM3535 provides an ambient light sensing input for use with ambient backlight control. By connecting the

anode of a photo diode / sensor to the sensor input pins, and configuring the appropriate ALS resistors, the

LM3535 can be configured to adjust the diode current to five unique settings, corresponding to four adjustable

light region trip points. Additionally, when the LM3535 determines that an ambient condition has changed, the

interrupt pin, when connected to a pullup resistor toggles to a 0 alerting the controller. See I2C Compatible

Interface for more details regarding the register configurations.

7.3.4 Dynamic Backlight Control Input (PWM Pin)

The pulse width modulation (PWM) pin allows a display driver utilizing dynamic backlight control (DBC) to adjust

the LED brightness based on the content. The PWM input can be turned on or off (Acknowledge or Ignore), and

the polarity can be flipped (active high or active low) through the I2C interface. The current sinks of the LM3535

require approximately 15 µs to reach steady-state target current. This turnon time sets the minimum usable PWM

pulse width for DBC/CABC.

7.3.5 LED Forward Voltage Monitoring

The LM3535 has the ability to switch gains (1× or 3/2×) based on the forward voltage of the LED load. This

ability to switch gains maximizes efficiency for a given load. Forward voltage monitoring occurs on all diode pins.

At higher input voltages, the LM3535 operates in pass mode, allowing the VOUT voltage to track the input voltage.

As the input voltage drops, the voltage on the Dxx pins also drops (VDXX = VVOUT – VLEDx). Once any of the active

Dxx pins reaches a voltage approximately equal to 130 mV, the charge pump will switch to the gain of 3/2. This

switchover ensures that the current through the LEDs never becomes pinched off due to a lack of headroom

across the current sinks. Once a gain transition occurs, the LM3535 remains in the gain of 3/2 until an I2C write

to the part occurs. At that time, the LM3535 re-evaluates the LED conditions and selects the appropriate gain.

Only active Dxx pins are monitored.

7.3.6 Configurable Gain Transition Delay

To optimize efficiency, the LM3535 has a user selectable gain transition delay that allows the part to ignore short

duration input voltage drops. By default, the LM3535 does not change gains if the input voltage dip is shorter

than 3 to 6 milliseconds. There are three selectable gain transition delay ranges available on the LM3535. All

delay ranges are set within the VF Monitor Delay Register. See Internal Registers of LM3535 for more

information regarding the delay ranges.

7.3.7 Hardware Enable (HWEN)

The LM3535 has a hardware enable/reset pin (HWEN) that allows the device to be disabled by an external

controller without requiring an I2C write command. Under normal operation, hold the HWEN pin high (logic 1) to

prevent an unwanted reset. When the HWEN is driven low (logic 0), all internal control registers reset to the

default states, and the device becomes disabled. See the Electrical Characteristics section of the data sheet for

required voltage thresholds.

SDIO

SCL

STO condition

START condition

S P

SCL

SDIO

data

change

allowed

data

valid data

change

allowed

data

valid data

change

allowed

LM3535

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7.4 Device Functional Modes

7.4.1 Shutdown

The LM3535 enters shutdown mode if HWEN pin is held low. In this mode, the LM3535 has a shutdown current

of 1.7 µA. I2C communication is not possible when in shutdown.

7.4.2 Standby

The LM3535 enters standby mode if HWEN pin is held high and when the ENx bits are set to 0. In this mode, the

LM3535 has a standby current of 1.7 µA. I2C communication is possible when in standby.

7.4.3 Active Mode

The LM3535 enters active mode if HWEN pin is held high and when any of the ENx bits are set to 1. When the

LM3535 is in pass-mode operation, the typical quiescent current drawn is 1.09 mA. When the LM3535 is in

boost-mode operation, the typical quiescent current drawn is 2.86 mA. I2C communication is possible when in

active mode.

7.5 Programming

7.5.1 I2C Compatible Interface

7.5.1.1 Data Validity

The data on SDIO line must be stable during the HIGH period of the clock signal (SCL). In other words, state of

the data line can only be changed when SCL is LOW.

Figure 17. Data Validity Diagram

A pullup resistor between the VIO line and SDIO of the controller must be greater than [(VIO – VOL)/3mA] to

meet the VOL requirement on SDIO. Using a larger pullup resistor results in lower switching current with slower

edges, while using a smaller pullup results in higher switching currents with faster edges.

7.5.1.2 Start and Stop Conditions

START and STOP conditions classify the beginning and the end of the I2C session. A START condition is

defined as SDIO signal transitioning from HIGH to LOW while SCL line is HIGH. A STOP condition is defined as

the SDIO transitioning from LOW to HIGH while SCL is HIGH. The I2C master always generates START and

STOP conditions. The I2C bus is considered to be busy after a START condition and free after a STOP condition.

During data transmission, the I2C master can generate repeated START conditions. First START and repeated

START conditions are equivalent, function-wise.

Figure 18. Start and Stop Conditions

start msb Chip Address lsb w ack msb Register Add lsb ack msb DATA lsb ack stop

ack from slave ack from slave ack from slave

SCL

SDIO

start Id = 38h w ack addr = 10h ack ackDGGUHVVK¶3F data stop

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Programming (continued)

7.5.1.3 Transferring Data

Every byte put on the SDIO line must be eight bits long, with the most significant bit (MSB) transferred first. Each

byte of data has to be followed by an acknowledge bit. The acknowledge related clock pulse is generated by the

master. The master releases the SDIO line (HIGH) during the acknowledge clock pulse. The LM3535 pulls down

the SDIO line during the 9th clock pulse, signifying an acknowledge. The LM3535 generates an acknowledge

after each byte is received. There is no acknowledge created after data is read from the LM3535.

After the START condition, the I2C master sends a chip address. This address is seven bits long followed by an

eighth bit which is a data direction bit (R/W). The LM3535 7-bit address is 38h. For the eighth bit, a “0” indicates

a WRITE and a “1” indicates a READ. The second byte selects the register to which the data will be written. The

third byte contains data to write to the selected register.

Figure 19. Write Cycle

W = Write (SDIO = 0)

R = Read (SDIO = 1)

Ack = Acknowledge (SDIO Pulled Down by Either Master or Slave)

Id = Chip Address, 38h For Lm3535

7.5.1.4 I2C Compatible Chip Address

The 7-bit chip address for LM3535 is 111000, or 0x38.

7.5.1.5 Internal Registers of LM3535

Diode Enable Register 0x10 0000 0000 (0x00)

Configuration Register 0x20 0000 0000 (0x00)

Options Register 0x30 0000 0000 (0x00)

ALS Zone Readback 0x40 1111 0000 (0xF0)

ALS Control Register 0x50 0000 0011 (0x03)

ALS Resistor Register 0x51 0000 0000 (0x00)

ALS Zone Boundary #0 0x60 0011 0011 (0x33)

ALS Zone Boundary #1 0x61 0110 0110 (0x66)

ALS Zone Boundary #2 0x62 1001 1001 (0x99)

ALS Zone Boundary #3 0x63 1100 1100 (0xCC)

ALS Brightness Zone #1 0x70 1001 1001 (0x99)

ALS Brightness Zone #2 0x71 1011 0110 (0xB6)

ALS Brightness Zone #3 0x72 1100 1100 (0xCC)

ALS Brightness Zone #4 0x73 1110 0110 (0xE6)

ALS Brightness Zone #5 0x74 1111 1111 (0xFF)

Group A Brightness Control Register 0xA0 1000 0000 (0x80)

Group B Brightness Control Register 0xB0 1100 0000 (0xC0)

Group C Brightness Control Register 0xC0 1111 1000 (0xF8)

Options Register

GT1

bit7 GT0

bit6 RD2

bit5 RD1

bit4 RD0

bit3 RU2

bit2 RU1

bit1 RU0

bit0

MSB LSB

Configuration Register

ALSF

bit7 ALS-EN

bit6 ALS-ENB

bit5 ALS-ENA

bit4 62A

bit3 53A

bit2 PWM-P

bit1 PWM-EN

bit0

ENC

bit7 EN1B

bit6 EN62

bit5 EN53

bit4 EN4A

bit3 EN3A

bit2 EN2A

bit1 EN1A

bit0

MSB LSB

Control Register

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Figure 20. Diode Enable Register Description

Internal Hex Address: 0x10

Each ENx Bit controls the state of the corresponding current sink. Writing a 1 to these bits enables the current

sinks. Writing a 0 disables the current sinks. In order for current to begin flowing through the BankA current

sinks, the brightness codes stored in either the BankA Brightness register or the ALS Brightness registers (with

ALS enabled) must be non-zero. The BankA current sinks can be disabled in two different manors. Writing 0 to

the ENx bits when the current sinks are active will disable the current sinks without going through the ramp down

sequence. Additionally, setting the BankA brightness code to 0 when the current sinks are active (ENx = 1) does

force the diode current to ramp down. All ramping behavior is tied to the BankA Brightness or ALS Brightness

current.

Writing a '1 to ENC, EN1B, EN62 and EN53 (when EN62 and EN53 are assigned to BankB) by default enables

the corresponding current sinks and drive the LEDs to the current value stored in the BankB and BankC

brightness registers. Writing a 0 to these bits immediately disables the current sinks.

The ENC and EN1B bits are ignored if the D1C/ALS pin is configured as an ALS input and if the D1B/INT is

configured as an interrupt flag.

Figure 21. Configuration Register Description

Internal Hex Address:0x20

• PWM-EN: PWM Input Enable. Writing a 1 = Enable, and a 0 = Ignore (default).

• PWM-P: PWM Input Polarity. Writing a 0 = Active High (default) and a 1 = Active Low.

• 53A: Assign D53 diode to BankA. Writing a 0 assigns D53 to BankB (default) and a 1 assigns D53 to BankA.

• 62A: Assign D62 diode to BankA. Writing a 0 assigns D62 to BankB (default) and a 1 assigns D62 to BankA.

• ALS-ENA: Enable ALS on BankA. Writing a 1 enables ALS control of diode current and a 0 (default) forces

the BankA current to the value stored in the BankA brightness register. The ALS-EN bit must be set to a 1 for

the ALS block to control the BankA brightness.

• ALS-ENB: Enable ALS on BankB. Writing a 1 enables ALS control of diode current and a 0 (default) forces

the BankB current to the value stored in the BankB brightness register. The ALS-EN bit must be set to a 1 for

the ALS block to control the BankB brightness. The ALS function for BankB is different than bankA in that the

ALS will only enable and disable the BankB diodes depending on the ALS zone chosen by the user. BankA

utilizes the 5 different zone brightness registers (Addresses 0x70 to 0x74).

• ALS-EN: Enables ALS monitoring. Writing a 1 enables the ALS monitoring circuitry and a 0 disables it. This

feature can be enabled without having the current sinks or charge pump active. The ALS value is updated in

• ALSF: ALS Interrupt Enable. Writing a 1 sets the D1B/INT pin to the ALS interrupt pin and writing a 0 (default)

sets the pin to a BankB current sink.

Figure 22. Options Register

Internal Hex Address: 0x30

ILED (mA) |25 x 0.85

[44 ± {(N+1)/2.91}]

BRC (#) |127+17.9 xLN(ILED(mA)/25 mA)

bit7 1

bit6 1

bit5 1

bit4 1

bit3 D1C2

bit2 D1C1

bit1 D1C0

bit0

MSB LSB

DxC Brightness Control

MSB LSB

DxB Brightness Control

bit7 1

bit6 ALSZT2

bit5 ALSZT1

bit4 ALSZT0

bit3 DxB2

bit2 DxB1

bit1 DxB0

bit0

bit7 DxA6

bit6 DxA5

bit5 DxA4

bit4 DxA3

bit3 DxA2

bit2 DxA1

bit1 DxA0

bit0

MSB LSB

DxA Brightness Control

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• RD0-RD2: Diode Current Ramp Down Step Time. : ‘000’ = 6 µs, ‘001’ = 0.77 ms, ‘010’ = 1.5 ms, ‘011’ = 3

ms, ‘100’ = 6 ms, ‘101’ = 12 ms, ‘110’ = 25ms, ‘111’ = 50ms

• RU0-RU2: Diode Current Ramp Up Step Time. : ‘000’ = 6 µs, ‘001’ = 0.77 ms, ‘010’ = 1.5 ms, ‘011’ = 3 ms,

‘100’ = 6 ms, ‘101’ = 12 ms, ‘110’ = 25ms, ‘111’ = 50ms

• GT0-GT1: Gain Transition Filter. The value stored in this register determines the filter time used to make a

gain transition in the event of an input line step. Filter times = ‘00’ = 3-6 ms, ‘01’ = 0.8-1.5 ms, ‘10’ = 20 µs,

On LM3535-2ALS, '11' = 1µs, On LM3535, ‘11’ = DO NOT USE

The Ramp-Up and Ramp-Down times follow the equatios: TRAMP = (NStart – NTarget) × Ramp-Step Time

Figure 23. Brightness Control Register Description

Internal Hex Address: 0xa0 (Groupa), 0xb0 (Groupb), 0xc0 (Groupc)

NOTE

DxA6-DxA0: Sets Brightness for DxA pins (GroupA). 1111111 = Fullscale. Code 0 in this

DxB2-DxB0: Sets Brightness for DxB pins (GroupB). 111 = Fullscale

ALSZT2-ALSZT0: Sets the Brightness Zone boundary used to enable and disable BankB

diodes based upon ambient lighting conditions.

DxC2-DxC0: Sets Brightness for D1C pin. 111 = Fullscale

The BankA Current can be approximated by Equation 1 where N = BRC = the decimal

value stored in either the BankA Brightness Register or the five different ALS Zone

Brightness Registers:

(1)

MSB LSB

ALS Zone Register

bit7 1

bit6 1

bit5 1

bit4 FLAG

bit3 ZONE2

bit2 ZONE1

bit1 ZONE0

bit0

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Table 1. ILED vs Brightness Register Data

BankA or

ALS

Brightness

Data

% of

ILED_MAX

BankA or ALS

Brightness Data % of ILED_MAX BankA or ALS

Brightness

Data

% of ILED_MAX

0000000 0.000% 0100000 0.803% 1000000 4.078% 1100000 20.713%

0000001 0.166% 0100001 0.845% 1000001 4.290% 1100001 21.792%

0000010 0.175% 0100010 0.889% 1000010 4.514% 1100010 22.928%

0000011 0.184% 0100011 0.935% 1000011 4.749% 1100011 24.122%

0000100 0.194% 0100100 0.984% 1000100 4.996% 1100100 25.379%

0000101 0.204% 0100101 1.035% 1000101 5.257% 1100101 26.701%

0000110 0.214% 0100110 1.089% 1000110 5.531% 1100110 28.092%

0000111 0.226% 0100111 1.146% 1000111 5.819% 1100111 29.556%

0001000 0.237% 0101000 1.205% 1001000 6.122% 1101000 31.096%

0001001 0.250% 0101001 1.268% 1001001 6.441% 1101001 32.716%

0001010 0.263% 0101010 1.334% 1001010 6.776% 1101010 34.420%

0001011 0.276% 0101011 1.404% 1001011 7.129% 1101011 36.213%

0001100 0.291% 0101100 1.477% 1001100 7.501% 1101100 38.100%

0001101 0.306% 0101101 1.554% 1001101 7.892% 1101101 40.085%

0001110 0.322% 0101110 1.635% 1001110 8.303% 1101110 42.173%

0001111 0.339% 0101111 1.720% 1001111 8.735% 1101111 44.371%

0010000 0.356% 0110000 1.809% 1010000 9.191% 1110000 46.682%

0010001 0.375% 0110001 1.904% 1010001 9.669% 1110001 49.114%

0010010 0.394% 0110010 2.003% 1010010 10.173% 1110010 51.673%

0010011 0.415% 0110011 2.107% 1010011 10.703% 1110011 54.365%

0010100 0.436% 0110100 2.217% 1010100 11.261% 1110100 57.198%

0010101 0.459% 0110101 2.332% 1010101 11.847% 1110101 60.178%

0010110 0.483% 0110110 2.454% 1010110 12.465% 1110110 63.313%

0010111 0.508% 0111011 2.582% 1010111 13.114% 1110111 66.611%

0011000 0.535% 0110111 2.716% 1011000 13.797% 1111000 70.082%

0011001 0.563% 0111000 2.858% 1011001 14.516% 1111001 73.733%

0011010 0.592% 0111001 3.007% 1011010 15.272% 1111010 77.574%

0011011 0.623% 0111010 3.163% 1011011 16.068% 1111011 81.616%

0011100 0.655% 0111011 3.328% 1011100 16.905% 1111100 85.868%

0011101 0.689% 0111100 3.502% 1011101 17.786% 1111101 90.341%

0011110 0.725% 0111101 3.684% 1011110 18.713% 1111110 95.048%

0011111 0.763% 0111111 3.876% 1011111 19.687% 1111111 100.000%

GroupB and GroupC Brightness Levels = 2.5, 5, 7.5, 10, 12.5, 15, 17.5, 25mA

Figure 24. Als Zone Register Description

Internal Hex Address: 0x40

• ZONE0-ZONE2: ALS Zone information: '000’ = Zone0, ‘001’ = Zone1, ‘010’ = Zone2, ‘011’ = Zone3, ‘100’ =

Zone4. Other combinations not used

• FLAG: ALS Transition Flag. 1 = Transition has occurred. 0 = No Transition. The FLAG bit is cleared once the

0x40 register has been read.

MSB LSB

Zone Boundary Registers

ZB7

bit7 ZB6

bit6 ZB5

bit5 ZB4

bit4 ZB3

bit3 ZB2

bit2 ZB1

bit1 ZB0

bit0

0x60 = Zone Boundary 0

0x61 = Zone Boundary 1

0x62 = zone Boundary 2

0x63 = Zone Boundary 3

MSB LSB

Internal ALS Resistor Register

bit7 R2

bit6 R1

bit5 R0

bit4 RFU

bit3 RFU

bit2 RFU

bit1 RFU

bit0

MSB LSB

ALS Control / SI Rev Register

ALS-EN

bit7 AVE2

bit6 AVE1

bit5 AVE0

bit4 0

bit3 0

bit2 Rev1

bit1 Rev0

bit0

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Figure 25. ALS Control / Silicon Revision Register Description

Internal Hex Address: 0x50

• Rev0-Rev1 : Stores the Silicon Revision value. LM3535 = 11

• AVE2-AVE0: Sets Averaging Time for ALS sampling. Need two to three Averaging periods to make transition

decision. 000 = 25 ms, 001 = 50 ms, 010 = 100 ms 011 = 200 ms, 100 = 400 ms, 101 = 800 ms 110 = 1.6 s,

111 = 3.2s

Figure 26. ALS Resistor Control Register Description

Internal Hex Address: 0x51

• R0-R3: Sets the internal ALS resistor value

Table 2. Internal ALS Resistor Table

R3 R2 R1 R0 ALS RESISTOR VALUE (Ω)

0 0 0 0 High Impedance

0 0 0 1 13.6 k

0 0 1 0 9.08 k

0 0 1 1 5.47 k

0 1 0 0 2.32 k

0 1 0 1 1.99 k

0 1 1 0 1.86 k

0 1 1 1 1.65 k

1 0 0 0 1.18 k

1 0 0 1 1.1 k

1 0 1 0 1.06 k

1 0 1 1 986

1 1 0 0 804

1 1 0 1 764

1 1 1 0 745

1 1 1 1 711

Figure 27. Zone Boundary Register Descriptions

• ZB7-ZB0: Sets Zone Boundary Lines with a Falling ALS voltage.

– 0xFF w/ ALS Falling = 992.3 mV (typical).

MSB LSB

Zone Brightnes Registers

bit7 B6

bit6 B5

bit5 B4

bit4 B3

bit3 B2

bit2 B1

bit1 B0

bit0

All Versions

0x70 = Zone 0 Brightness

0x71 = Zone 1 Brightness

0x72 = Zone 2 Brightness

0x73 = Zone 3 Brightness

0x74 = Zone 4 Brightness

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–VTRIP-LOW (typ) = [Boundary Code × 3.874mV] + 4.45mV

– For boundary codes 2 to 255. Code 0 and Code1 are mapped to equal the Code2 value.

– Each zone line has approx. 5.5mV of hysteresis between the falling and rising ALS trip points.

• Zone Boundary 0 is the line between ALS Zone 0 and Zone 1. Default Code = 0x33 or approximately 200 mV

• Zone Boundary 1 is the line between ALS Zone 1 and Zone 2. Default Code = 0x66 or approximately 400 mV

• Zone Boundary 2 is the line between ALS Zone 2 and Zone 3. Default Code = 0x99 or approximately 600 mV

• Zone Boundary 3 is the line between ALS Zone 3 and Zone 4. Default Code = 0xCC or approximately 800

Figure 28. Zone Brightness Region Register Description

• B7-B0: Sets the ALS Zone Brightness Code. B7 always = 1 (unused). Use the formula found in the BankA

Brightness Register Description (Figure 23) to set the desired target brightness. Default values can be

overwritten

• Zone0 Brightness Address = 0x70. Default = 0x99 (25) or 0.084 mA

• Zone1 Brightness Address = 0x71. Default = 0xB6 (54) or 0.164 mA

• Zone2 Brightness Address = 0x72. Default = 0xCC (76) or 1.45 mA

• Zone3 Brightness Address = 0x73. Default = 0xE6 (102) or 6.17 mA

• Zone4 Brightness Address = 0x74. Default = 0xFF (127) or 25 mA

LM3535

D1A

D2AD3AD4A D53

I2C

Control

Signals

D1B/

INT

SDIO

1µF

1µF 1µF

1µF GND

D62

C1+

C1-

C2+

C2- SCL

D1C/

ALS

HWEN

GROUP A

GROUP B GROUP C

PWM

VIO

VIN VOUT

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8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

8.1 Application Information

8.2 Typical Application

The LM3535 device is a highly integrated LED driver capable of driving 8 LEDs in parallel for large display

applications. Independent LED control allows selection of a subset of the 6 main display LEDs for partial-

illumination applications. In addition to the main bank of 6, the LM3535 is capable of driving an additional 2

independently controlled LEDs to support Indicator applications.

Figure 29. LM3535 Typical Application

8.2.1 Design Requirements

A detailed design procedure is described based on a design example. For this design example, use the

parameters listed in Table 3 as the input parameters.

Table 3. Design Example Parameters

DESIGN PARAMETER VALUE

Input voltage VIN 2.7 V to 5.5 V

LED current maximum per channel 25 mA

Operating frequency 1.33 MHz

Vdd

Vsns

LED Driver

Brightness

ALS Select

VOUT

Zone Discriminator

ALS Path Functional Diagram

bits 8

ALSRS

ALS Resistor

Select Register

8 bits

A/D Averager

(LPF)

Ramp

Control

7 bits 7 bits 7 bits

3 bits3 bits

Ramp-Down

Rate

Selection

Ramp-Up

Rate

Selection

7 bits

User Selectable w/

Typical Defaults User Selectable w/

Typical Defaults

Light output

targets for

each of 5

ambient

light zones

Input Light

Zone

Definition

Registers

Z4 target light

3 Zline

2 Zline

1 Zline

0 Zline

Z3 target light 2

Z2 target light 1

Z1 target light 0

Z0 target light

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8.2.2 Detailed Design Procedure

8.2.2.1 Ambient Light Sensing

8.2.2.1.1 Ambient Light Sensor Block

The LM3535 incorporates an ambient light sensing interface (ALS) which translates an analog output ambient

light sensor to a user specified brightness level. The ambient light sensing circuit has 4 programmable

boundaries (ZB0 – ZB3) which define 5 ambient brightness zones. Each ambient brightness zone corresponds to

a programmable brightness threshold (Z0T – Z4T).

Furthermore, the ambient light sensing input features 15 internal software-selectable voltage setting resistors.

This allows the LM3535 the capability of interfacing with a wide selection of ambient light sensors. Additionally,

the ALS inputs can be configured as high impedance, thus providing for a true shutdown during low power

modes. The ALS resistors are selectable through the ALS Resistor Select Register (see Table 2). Figure 30

shows a functional block diagram of the ambient light sensor input.

Figure 30. Ambient Light Sensor Functional Block Diagram

8.2.2.1.2 ALS Operation

The ambient light sensor input has a 0 to 1 V operational input voltage range. The Specifications shows the

LM3535 with an ambient light sensor (AVAGO, APDS-9005) and the internal ALS Resistor Select Register set to

0x40 (2.32 kΩ). This circuit converts 0 to 1000 LUX light into approximately a 0 to 850 mV linear output voltage.

The voltage at the active ambient light sensor input is compared against the 8 bit values programmed into the

Zone Boundary Registers (ZB0-ZB3). When the ambient light sensor output crosses one of the ZB0 – ZB3

programmed thresholds the internal ALS circuitry will smoothly transition the LED current to the new 7 bit

brightness level as programmed into the appropriate Zone Target Register (Z0T – Z4T, see Figure 28).

With bits [6:4] of the Configuration Register set to 1 (Bit6 = ALS Block Enable, Bit5 = BankB ALS Enable, Bit4 =

BankA ALS Enable), the LM3535 is configured for ambient light current Control. In this mode the ambient light

sensing input (ALS) monitors the output of analog output ambient light sensing photo diode and adjusts the LED

current depending on the ambient light. The ambient light sensing circuit has 4 configurable ambient light

boundaries (ZB0 – ZB3) programmed through the four (8-bit) Zone Boundary Registers. These zone boundaries

define 5 ambient brightness zones.

On start-up the 4 Zone Boundary Registers are pre-loaded with 0x33 (51d), 0x66 (102d), 0x99 (153d), and 0xCC

(204d). The ALS input has a 1-V active input voltage range which makes the default Zone Boundaries approx.

set at:

ILED = ILED_FS u ZoneTarget0 = 25 mA u 0.336% | 84 PA.

Ambient Light (lux)

Vsense

Vals_ref

= 1V

ZB3

ZB0

ZB1

ZB2

Zone 0

Zone 4

Zone 3

Zone 2

Zone 1

LED Driver Input Code (0-127)

LED Current

Full

Scale

Z0T Z4T

Z3TZ2TZ1T

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Zone Boundary 0 = 200 mV

Zone Boundary 1 = 400 mV

Zone Boundary 2 = 600 mV

Zone Boundary 3 = 800 mV

These Zone Boundary Registers are all 8-bit (readable and writable) registers. By default, the first zone (Z0) is

defined between 0 and 200 mV, default for Z1 is defined between 200 mV and 400 mV, Z2 is defined between

400 mV and 600 mV, Z3 is defined between 600 mV and 800 mV, and Z4 is defined between 800 mV and 1 V.

The default settings for the 5 Zone Target Registers are 0x19, 0x33, 0x4C, 0x66, and 0x7F. This corresponds to

LED brightness settings of 84 µA, 164 µA, 1.45 mA, 6.17 mA and 25 mA of current, respectively. See Figure 31.

Figure 31. ALS Zone to LED Brightness Mapping

8.2.2.1.2.1 ALS Configuration Example

As an example, assume that the APDS-9005 is used as the ambient light sensing photo diode with its output

connected to the ALS input. The ALS Resistor Select Register (Address 0x51) is loaded with 0x40 which

configures the ALS input for a 2.32-kΩinternal pulldown resistor (see Table 2). This gives the output of the

APDS-9005 a typical voltage swing of 0 to 875mV with a 0 to 1k LUX change in ambient light (0.875mV/Lux).

Next, the Configuration Register (Address 0x20) is programmed with 0xDC, the ALS Control Register (Address

0x50) programmed to 0x40 and the Control Register is programmed to 0x3F . This configures the device ALS

interface for:

• Ambient Light Current Control for BankA enabled

• ALS circuitry enabled

• Assigns D53 and D62 to bankA

• Sets the ALS Averaging Time to 400 ms

Next, the Control Register (Address 0x10) is programmed with 0x3F which enables the 6 LEDs via the I2C-

compatible interface.

Now assume that the APDS-9005 ambient light sensor detects a 100 LUX ambient light at its input. This forces

the ambient light sensor output (and the ALS input) to 87.5 mV corresponding to Zone 0. Since Zone 0 points to

the brightness code programmed in Zone Target Register 0 (loaded with code 0x19), the LED current becomes:

(2)

Zone0

Zone1

Zone2

Zone3

Zone4

1342211

Averager

Output

Zone

Average 1.0 1.75 3.5 4.0 2.25 2.25 1.5

ILED = ILED_FS u ZoneTarget2 = 25 mA u 5.781% | 1.45 mA

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Next assume that the ambient light changes to 500 LUX (corresponding to an ALS voltage of 437.5 mV). This

moves the ambient light into Zone 2 which corresponds to Zone Target Register 2 (loaded with code 0x4C) the

LED current then becomes:

(3)

8.2.2.1.3 ALS Averaging Time

The ALS averaging time is the time over which the averager block collects samples from the A/D converter and

then averages them to pass to the discriminator block (see Figure 32). Ambient light sensor samples are

averaged and then further processed by the discriminator block to provide rejection of noise and transient

signals. The averager is configurable with 8 different averaging times to provide varying amounts of noise and

transient rejection (see Figure 25). The discriminator block algorithm has a maximum latency of two averaging

cycles, therefore the averaging time selection determines the amount of delay that will exist between a steady

state change in the ambient light conditions and the associated change of the backlight illumination. For

example, the A/D converter samples the ALS inputs at 16 kHz. If the averaging time is set to 800 ms, the

averager sends the updated zone information to the discriminator every 800 ms. This zone information contains

the average of approximately 12800 samples (800 ms × 16 kHz). Due to the latency of 2 averaging cycles, when

there is a steady-state change in the ambient light, the LED current begins to transition to the appropriate target

value after approximately 1600 ms have elapsed.

The sign and magnitude of these averager outputs are used to determine whether the LM3535 should change

brightness zones. The averager block follows the following rules to make a zone transition:

• The averager always begins with a Zone0 reading stored at start-up. If the main display LEDs are active

before the ALS block is enabled, it is recommended that the ALS-EN bit be enabled at least 3 averaging

cycles times before the ALS-ENA bit is enabled.

• The averager always rounds down to the lower zone in the case of a non-integer zone average (1.2 rounds to

1 and 1.75 also rounds to 1). Figure 32 shows an example of how the Averager will make the zone decisions

for different ambient conditions.

Figure 32. Averager Calculation

• The two most current averaging samples are used to make zone change decisions.

• To make a zone change, data from three averaging cycles are needed (starting value, first transition, second

transition or rest).

• To Increase the brightness zone, a positive averager zone output must be followed by a second positive

averager output or a repeated Averager zone. ('+' to '+' or '+' to 'Rest')

• To decrease the brightness zone, a negative averager zone output must be followed by a second negative

averager output or a repeated Averager zone. ('-' to '-' or '-' to 'Rest')

• In the case of two increases or decreases in the averager output, the LM3535 transitions to zone equal to the

last averager output.

Figure 33 provides a graphical representation of the behavior of the averager.

Zone0

Zone1

Zone2

Zone3

Zone4

Zone0

Zone1

Zone2

Zone3

Zone4

1 Ave

Period

Zone0

Zone1

Zone2

Zone3

Zone4

Averager Output

LED Brightness

Zone

ALS Input

Zone0

Zone1

Zone2

Zone3

Zone4

µ5¶= Rest, µ+¶= Increase, µ-µ= Decrease

0 1 1 3 4 40 4

+ R + + + R RR

Averager Output

Brightness

Zone

Zone0

Zone1

Zone2

Zone3

Zone4

4 3 3 1 0 04 0

- R - - - R RR

Brightness

Zone

Zone0

Zone1

Zone2

Zone3

Zone4

0 4 4 4 4 10 1

+ + - + - - RR

Brightness

Zone

LM3535

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Figure 33. Brightness Zone Change Examples

Using the diagram for the ALS block (Figure 30), Figure 34 shows the flow of information starting with the A/D,

transitioning to the averager, followed by the discriminator. Each state filters the previous output to help prevent

unwanted zone to zone transitions.

Figure 34. Ambient Light Input To Backlight Mapping

LED

Driver

BRT

ALS Select

VOUT

7 bits 7 bits

LED Ramp

Rate Control

3 bits

Ramp Rate

Increasing

7 bits

DAC

Active Zone

Target

7 bits

Dig Code

3 bits

Ramp Rate

Decreasing

Full Scale

Current

PWM

EN_PWM bit

PWM Polarity Bit

(0 = active high,

1 = active low)

Note 1

Note 2

Note 3

For EN_PWM bit = 1

For EN_PWM bit = 0

Note 3:

DPWM Is a Scaler between 0 and 1 and corresponds to the duty cycle of the PWM input signal

Note 2:

ACODE Is a Scaler between 0 and 1 based on the Brightness Data or Zone Target Data Depending on the ALS Select Bit

Note 1:

IFS = 25 mA

ILED

ILED = IFS x ACODE x DPWM

ILED = IFS x ACODE

ACODE

DPWM

Zone0

Zone1

Zone2

Zone3

Zone4

1342211

Averager

Output

1 Ave

Period

tBRGT-CHANGE =

2.75 Average

Time tBRGT-CHANGE =

1.75 Average

Time

LM3535

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Product Folder Links: LM3535

When using the ALS averaging functionality, it is important to remember that the averaging cycle is free running

and is not synchronized with changing ambient lighting conditions. Due to the nature of the averager round down,

an increase in brightness can take between 2 and 3 averaging cycles to change zones while a decrease in

brightness can take between 1 and 2 averaging cycles to change. See Figure 25 for a list of possible averager

periods. Figure 35 shows an example of how the perceived brightness change time can vary.

Figure 35. Perceived Brightness Change Time

8.2.2.1.4 Ambient Light Current Control + PWM

The ambient light current control can also be a function of the PWM input duty cycle. Assume the LM3535 is

configured as described in the previous example, but this time the Enable PWM bit set to 1 (Configuration

Figure 36. Current Control Block Diagram

ILED = ILED_FS u ZoneTarget5 u D = 25 mA u 100% u 50% | 12.5 mA

LM3535

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8.2.2.1.4.1 ALS + PWM Example

In this example, the APDS-9005 sensor detects that the ambient light has changed to 1 kLux. The voltage at the

ALS input is now approximately 875 mV and the ambient light falls within Zone 5. This causes the LED

brightness to be a function of Zone Target Register 5 (loaded with 0x7F). Now assume the PWM input is also

driven with a 50% duty cycle pulsed waveform. The LED current now becomes:

(4)

8.2.2.2 LED Configurations

The LM3535 has a total of 8 current sinks capable of sinking 200 mA of total diode current. These 8 current sinks

are configured to operate in three independently controlled lighting regions. GroupA has four dedicated current

sinks, while GroupB and GroupC each have one. To add greater lighting flexibility, the LM3535 has two

additional drivers (D53 and D62) that can be assigned to either GroupA or GroupB through a setting in the

general purpose register.

At start-up, the default condition is four LEDs in GroupA, three LEDs in GroupB and a single LED in GroupC

(NOTE: GroupC only consists of a single current sink (D1C) under any configuration). Bits 53A and 62A in the

general purpose register control where current sinks D53 and D62 are assigned. By writing a 1 to the 53A or 62A

bits, D53 and D62 become assigned to the GroupA lighting region. Writing a 0 to these bits assigns D53 and

D62 to the GroupB lighting region. With this added flexibility, the LM3535 is capable of supporting applications

requiring 4, 5, or 6 LEDs for main display lighting, while still providing additional current sinks that can be used

for a wide variety of lighting functions.

8.2.2.3 Maximum Output Current, Maximum LED Voltage, Minimum Input Voltage

The LM3535 can drive 8 LEDs at 25 mA each (GroupA , GroupB, GroupC) from an input voltage as low as 3.2 V,

as long as the LEDs have a forward voltage of 3.6 V or less (room temperature).

The statement above is a simple example of the LED drive capability of the LM3535. The statement contains the

key application parameters that are required to validate an LED-drive design using the LM3535: LED current

(ILEDx), number of active LEDs (Nx), LED forward voltage (VLED), and minimum input voltage (VIN-MIN).

Equation 5 and Equation 6 can be used to estimate the maximum output current capability of the LM3535:

ILED_MAX = [(1.5 x VIN) – VLED – (IADDITIONAL × ROUT)] / [(Nx× ROUT)+kHRx] (5)

ILED_MAX = [(1.5 x VIN )-VLED – (IADDITIONAL × 2.4 Ω)] / [(Nx× 2.4 Ω)+kHRx] (6)

IADDITIONAL is the additional current that could be delivered to the other LED groups.

ROUT – Output resistance. This parameter models the internal losses of the charge pump that result in voltage

droop at the pump output VOUT. Since the magnitude of the voltage droop is proportional to the total output

current of the charge pump, the loss parameter is modeled as a resistance. The output resistance of the LM3535

is typically 2.4 Ω(VIN = 3.6 V, TA= 25°C) — see Equation 7:

VVOUT = (1.5 × VIN) – [(NA× ILEDA + NB× ILEDB + NC× ILEDC) × ROUT] (7)

kHR – Headroom constant. This parameter models the minimum voltage required to be present across the current

sinks for them to regulate properly. This minimum voltage is proportional to the programmed LED current, so the

constant has units of mV/mA. The typical kHR of the LM3535 is 4mV/mA — see Equation 8:

(VVOUT – VLEDx) > kHRx × ILEDx (8)

Typical Headroom Constant Values kHRA = kHRB = kHRC = 4 mV/mA (9)

Equation 5 is obtained from combining Equation 7 (the ROUT equation) with Equation 8 (the kHRx equation) and

solving for ILEDx. Maximum LED current is highly dependent on minimum input voltage and LED forward voltage.

Output current capability can be increased by raising the minimum input voltage of the application, or by

selecting an LED with a lower forward voltage. Excessive power dissipation may also limit output current

capability of an application.

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8.2.2.3.1 Total Output Current Capability

The maximum output current that can be drawn from the LM3535 is 200 mA.

DRIVER TYPE MAXIMUM Dxx CURRENT

DxA 25 mA per DxA pin

DxB 25 mA per DxB pin

D1C 25 mA

8.2.2.4 Parallel Connected and Unused Outputs

Connecting the outputs in parallel does not affect internal operation of the LM3535 and has no impact on the

Electrical Characteristics and limits previously presented. The available diode output current, maximum diode

voltage, and all other specifications provided in the Electrical Characteristics table apply to this parallel output

configuration, just as they do to the standard LED application circuit.

All Dx current sinks utilize LED forward voltage sensing circuitry to optimize the charge-pump gain for maximum

efficiency. Due to the nature of the sensing circuitry, TI recommends not leaving any of the Dx pins open when

the current sinks are enabled (ENx bits are set to 1). Leaving Dx pins unconnected forces the charge-pump into

3/2× mode over the entire VIN range negating any efficiency gain that could have been achieved by switching to

1× mode at higher input voltages.

If the D1B or D1C drivers are not going to be used, make sure that the ENB and ENC bits in the general purpose

8.2.2.5 Power Efficiency

Efficiency of LED drivers is commonly taken to be the ratio of power consumed by the LEDs (PLED) to the power

drawn at the input of the part (PIN). With a 3/2× – 1× charge pump, the input current is equal to the charge pump

gain times the output current (total LED current). The efficiency of the LM3535 can be predicted as follow:

PLEDTOTAL = (VLEDA × NA× ILEDA) + (VLEDB × NB× ILEDB) + (VLEDC × ILEDC) (10)

PIN = VIN × IIN (11)

PIN = VIN × (GAIN × ILEDTOTAL + IQ) (12)

E = (PLEDTOTAL / PIN) (13)

The LED voltage is the main contributor to the charge-pump gain selection process. Use of low forward-voltage

LEDs (3 V to 3.5 V) allows the LM3535 to stay in the gain of 1× for a higher percentage of the lithium-ion battery

voltage range when compared to the use of higher forward voltage LEDs (3.5 V to 4 V). See LED Forward

Voltage Monitoring for a more detailed description of the gain selection and transition process.

For an advanced analysis, TI recommends that power consumed by the circuit (VIN x IIN) for a given load be

evaluated rather than power efficiency.

8.2.2.6 Power Dissipation

The power dissipation (PDISS) and junction temperature (TJ) can be approximated with the equations below. PIN is

the power generated by the 3/2× – 1× charge pump, PLED is the power consumed by the LEDs, TAis the ambient

temperature, and RθJA is the junction-to-ambient thermal resistance for the DSBGA 20-bump package. VIN is the

input voltage to the LM3535, VLED is the nominal LED forward voltage, N is the number of LEDs and ILED is the

programmed LED current.

PDISS = PIN – PLEDA - PLEDB – PLEDC (14)

PDISS= (GAIN × VIN × IGroupA + GroupB + GroupC ) – (VLEDA × NA× ILEDA) – (VLEDB × NB× ILEDB) – (VLEDC × ILEDC) (15)

TJ= TA+ (PDISS x RθJA) (16)

The junction temperature rating takes precedence over the ambient temperature rating. The LM3535 may be

operated outside the ambient temperature rating, so long as the junction temperature of the device does not

exceed the maximum operating rating of 110°C. The maximum ambient temperature rating must be derated in

applications where high power dissipation and/or poor thermal resistance causes the junction temperature to

exceed 110°C.

VIN (V)

ηLED (%)

100

2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5

VLED = 3.6V

VLED = 3.3V

VLED = 3.0V

4 LEDs @ 25 mA each

VIN (V)

IIN (mA)

180

170

160

150

140

130

120

110

100

802.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5

VLED = 3.6V

VLED = 3.3V

VLED = 3.0V

4 LEDs @ 25 mA Each

LM3535

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8.2.2.7 Thermal Protection

Internal thermal protection circuitry disables the LM3535 when the junction temperature exceeds 150°C (typical).

This feature protects the device from being damaged by high die temperatures that might otherwise result from

excessive power dissipation. The device recovers and operates normally when the junction temperature falls

below 125°C (typical). It is important that the board layout provide good thermal conduction to keep the junction

temperature within the specified operating ratings.

8.2.2.8 Capacitor Selection

The LM3535 requires 4 external capacitors for proper operation (C1= C2= CIN = COUT = 1 µF). Surface-mount

multi-layer ceramic capacitors are recommended. These capacitors are small, inexpensive and have very low

equivalent series resistance (ESR < 20 mΩtypical). Tantalum capacitors, OS-CON capacitors, and aluminum

electrolytic capacitors are not recommended for use with the LM3535 due to their high ESR, as compared to

ceramic capacitors.

For most applications, ceramic capacitors with X7R or X5R temperature characteristic are preferred for use with

the LM3535. These capacitors have tight capacitance tolerance (as good as ±10%) and hold their value over

temperature (X7R: ±15% over –55°C to 125°C; X5R: ±15% over –55°C to 85°C).

Capacitors with Y5V or Z5U temperature characteristic are generally not recommended for use with the LM3535.

Capacitors with these temperature characteristics typically have wide capacitance tolerance (+80%, –20%) and

vary significantly over temperature (Y5V: +22%, –82% over –30°C to +85°C range; Z5U: +22%, –56% over

+10°C to +85°C range). Under some conditions, a nominal 1µF Y5V or Z5U capacitor could have a capacitance

of only 0.1 µF. Such detrimental deviation is likely to cause Y5V and Z5U capacitors to fail to meet the minimum

capacitance requirements of the LM3535.

The recommended voltage rating for the capacitors is 10 V to account for DC bias capacitance losses.

8.2.3 Application Curves

Figure 37. Input Current vs Input Voltage 4 LEDs Figure 38. LED Drive Efficiency vs Input Voltage 4 LEDs

VIN (V)

IDX MATCHING (%)

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5

BRC = 127

TA= -30°C

TA= +85°C

TA= +25°C

6 LEDs in BankA

VIN (V)

LED (%)

100

2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5

TA = -30°C and +25°C

6 LEDs @ 25 mA each

VLED = 3.3V

TA = +85°C

VIN (V)

ηLED (%)

100

2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5

VLED = 3.6V

VLED = 3.3V

VLED = 3.0V

8 LEDs @ 25 mA each

VIN (V)

IIN (mA)

340

300

260

220

180

2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5

VLED = 3.6V

VLED = 3.3V

VLED = 3.0V

8 LEDs @ 25 mA Each

VIN (V)

LED (%)

100

2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5

VLED = 3.6V

VLED = 3.3V

VLED = 3.0V

6 LEDs @ 25 mA each

VIN (V)

IIN (mA)

260

240

220

200

180

160

140

2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5

VLED = 3.6V

VLED = 3.3V

VLED = 3.0V

6 LEDs @ 25 mA Each

LM3535

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Figure 39. Input Current vs Input Voltage 6 LEDs Figure 40. LED Drive Efficiency vs Input Voltage 6 LEDs

Figure 41. Input Current vs Input Voltage 8 LEDs Figure 42. LED Drive Efficiency vs Input Voltage 8 LEDs

Figure 43. LED Drive Efficiency vs Input Voltage Tri-Temp

6 LEDs Figure 44. ILED Matching vs Input Voltage 6 LEDs

9 Power Supply Recommendations

The LM3535 is designed to operate from an input voltage supply range between 2.7 V and 5.5 V. This input

supply must be well regulated and capable to supply the required input current. If the input supply is located far

from the LM3535 additional bulk capacitance may be required in addition to the ceramic bypass capacitors.

LM3535

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10 Layout

10.1 Layout Guidelines

Proper board layout helps to ensure optimal performance of the LM3535 circuit. The following guidelines are

recommended:

• Place capacitors as close as possible to the LM3535, preferably on the same side of the board as the device.

• Use short, wide traces to connect the external capacitors to the LM3535 to minimize trace resistance and

inductance.

• Use a low resistance connection between ground and the GND pins of the LM3535. Using wide traces and/or

multiple vias to connect GND to a ground plane on the board is most advantageous.

10.2 Layout Example

Figure 45. Minimum Layout

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11 Device and Documentation Support

11.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper

right corner, click on Alert me to register and receive a weekly digest of any product information that has

changed. For change details, review the revision history included in any revised document.

11.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective

contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of

Use.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help

solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

11.3 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.5 Glossary

SLYZ022 —TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

PACKAGE OPTION ADDENDUM

www.ti.com 10-Jan-2018

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM3535TME/NOPB ACTIVE DSBGA YFQ 20 250 Green (RoHS

& no Sb/Br) SNAGCU Level-1-260C-UNLIM -30 to 85 3535

LM3535TMX/NOPB ACTIVE DSBGA YFQ 20 3000 Green (RoHS

& no Sb/Br) SNAGCU Level-1-260C-UNLIM -30 to 85 3535

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

PACKAGE OPTION ADDENDUM

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Addendum-Page 2

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM3535TME/NOPB DSBGA YFQ 20 250 178.0 8.4 1.89 2.2 0.76 4.0 8.0 Q1

LM3535TMX/NOPB DSBGA YFQ 20 3000 178.0 8.4 1.89 2.2 0.76 4.0 8.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 10-Jan-2018

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM3535TME/NOPB DSBGA YFQ 20 250 210.0 185.0 35.0

LM3535TMX/NOPB DSBGA YFQ 20 3000 210.0 185.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 10-Jan-2018

Pack Materials-Page 2

MECHANICAL DATA

YFQ0020xxx

www.ti.com

TMD20XXX (Rev D)

0.600±0.075

. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.

B. This drawing is subject to change without notice.

NOTES:

4215083/A 12/12

D: Max =

E: Max =

2.045 mm, Min =

1.64 mm, Min =

1.985 mm

1.58 mm

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