ROUT – Output resistance. This parameter models the internal
losses of the charge pump that result in voltage droop at the
pump output VOUT. Since the magnitude of the voltage droop
is proportional to the total output current of the charge pump,
the loss parameter is modeled as a resistance. The output
resistance of the LM3535 is typically 2.4Ω (VIN = 3.6V, TA =
25°C). In equation form:
VVOUT = (1.5 × VIN) – [(NA× ILEDA + NB × ILEDB + NC × ILEDC) ×
ROUT] (eq. 2)
kHR – Headroom constant. This parameter models the mini-
mum voltage required to be present across the current sinks
for them to regulate properly. This minimum voltage is pro-
portional to the programmed LED current, so the constant has
units of mV/mA. The typical kHR of the LM3535 is 4mV/mA. In
equation form:
(VVOUT – VLEDx) > kHRx × ILEDx (eq. 3)
Typical Headroom Constant Values
kHRA = kHRB = kHRC = 4 mV/mA
The "ILED-MAX" equation (eq. 1) is obtained from combining the
ROUT equation (eq. 2) with the kHRx equation (eq. 3) and solv-
ing for ILEDx. Maximum LED current is highly dependent on
minimum input voltage and LED forward voltage. Output cur-
rent capability can be increased by raising the minimum input
voltage of the application, or by selecting an LED with a lower
forward voltage. Excessive power dissipation may also limit
output current capability of an application.
Total Output Current Capability
The maximum output current that can be drawn from the
LM3535 is 200mA.
DRIVER TYPE MAXIMUM Dxx CURRENT
DxA 25mA per DxA Pin
DxB 25mA per DxB Pin
D1C 25mA
PARALLEL CONNECTED AND UNUSED OUTPUTS
Connecting the outputs in parallel does not affect internal op-
eration of the LM3535 and has no impact on the Electrical
Characteristics and limits previously presented. The available
diode output current, maximum diode voltage, and all other
specifications provided in the Electrical Characteristics table
apply to this parallel output configuration, just as they do to
the standard LED application circuit.
All Dx current sinks utilize LED forward voltage sensing cir-
cuitry to optimize the charge-pump gain for maximum effi-
ciency. Due to the nature of the sensing circuitry, it is not
recommended to leave any of the Dx pins open when the
current sinks are enabled (ENx bits are set to '1'). Leaving Dx
pins unconnected will force the charge-pump into 3/2× mode
over the entire VIN range negating any efficiency gain that
could have been achieved by switching to 1× mode at higher
input voltages.
If the D1B or D1C drivers are not going to be used, make sure
that the ENB and ENC bits in the general purpose register are
set to '0' to ensure optimal efficiency.
POWER EFFICIENCY
Efficiency of LED drivers is commonly taken to be the ratio of
power consumed by the LEDs (PLED) to the power drawn at
the input of the part (PIN). With a 3/2× - 1× charge pump, the
input current is equal to the charge pump gain times the output
current (total LED current). The efficiency of the LM3535 can
be predicted as follow:
PLEDTOTAL = (VLEDA × NA × ILEDA) +
(VLEDB × NB × ILEDB) + (VLEDC × ILEDC)
PIN = VIN × IIN
PIN = VIN × (GAIN × ILEDTOTAL + IQ)
E = (PLEDTOTAL ÷ PIN)
The LED voltage is the main contributor to the charge-pump
gain selection process. Use of low forward-voltage LEDs
(3.0V- to 3.5V) will allow the LM3535 to stay in the gain of 1×
for a higher percentage of the lithium-ion battery voltage
range when compared to the use of higher forward voltage
LEDs (3.5V to 4.0V). See the LED Forward Voltage Monitor-
ing section of this datasheet for a more detailed description
of the gain selection and transition process.
For an advanced analysis, it is recommended that power con-
sumed by the circuit (VIN x IIN) for a given load be evaluated
rather than power efficiency.
POWER DISSIPATION
The power dissipation (PDISS) and junction temperature (TJ)
can be approximated with the equations below. PIN is the
power generated by the 3/2× - 1× charge pump, PLED is the
power consumed by the LEDs, TA is the ambient temperature,
and θJA is the junction-to-ambient thermal resistance for the
micro SMD 20-bump package. VIN is the input voltage to the
LM3535, VLED is the nominal LED forward voltage, N is the
number of LEDs and ILED is the programmed LED current.
PDISS = PIN - PLEDA - PLEDB - PLEDC
PDISS= (GAIN × VIN × IGroupA + GroupB + GroupC ) - (VLEDA × NA ×
ILEDA) - (VLEDB × NB × ILEDB) - (VLEDC × ILEDC)
TJ = TA + (PDISS x θJA)
The junction temperature rating takes precedence over the
ambient temperature rating. The LM3535 may be operated
outside the ambient temperature rating, so long as the junc-
tion temperature of the device does not exceed the maximum
operating rating of 110°C. The maximum ambient tempera-
ture rating must be derated in applications where high power
dissipation and/or poor thermal resistance causes the junc-
tion temperature to exceed 110°C.
THERMAL PROTECTION
Internal thermal protection circuitry disables the LM3535
when the junction temperature exceeds 150°C (typ.). This
feature protects the device from being damaged by high die
temperatures that might otherwise result from excessive pow-
er dissipation. The device will recover and operate normally
when the junction temperature falls below 125°C (typ.). It is
important that the board layout provide good thermal conduc-
tion to keep the junction temperature within the specified
operating ratings.
CAPACITOR SELECTION
The LM3535 requires 4 external capacitors for proper opera-
tion (C1 = C2 = CIN = COUT = 1µF). Surface-mount multi-layer
ceramic capacitors are recommended. These capacitors are
small, inexpensive and have very low equivalent series re-
sistance (ESR <20mΩ typ.). Tantalum capacitors, OS-CON
capacitors, and aluminum electrolytic capacitors are not rec-
ommended for use with the LM3535 due to their high ESR,
as compared to ceramic capacitors.
For most applications, ceramic capacitors with X7R or X5R
temperature characteristic are preferred for use with the
LM3535. These capacitors have tight capacitance tolerance
(as good as ±10%) and hold their value over temperature
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LM3535