WARP2 SERIES IGBT WITH
ULTRAFAST SOFT RECOVERY DIODE
IRGP35B60PD
1www.irf.com
8/18/04
Features
•NPT Technology, Positive Temperature Coefficient
•Lower VCE(SAT)
•Lower Parasitic Capacitances
•Minimal Tail Current
•HEXFRED Ultra Fast Soft-Recovery Co-Pack Diode
•Tighter Distribution of Parameters
•Higher Reliability
Benefits
•Parallel Operation for Higher Current Applications
•Lower Conduction Losses and Switching Losses
•Higher Switching Frequency up to 150kHz
E
G
n-channel
C
VCES = 600V
VCE(on) typ. = 1.85V
@ VGE = 15V IC = 22A
Equivalent MOSFET
Parameters
RCE(on) typ. = 84mΩ
ID (FET equivalent) = 35A
Applications
•Telecom and Server SMPS
•PFC and ZVS SMPS Circuits
•Uninterruptable Power Supplies
•Consumer Electronics Power Supplies
TO-247AC
GCE
SMPS IGBT
Absolute Maximum Ratings Parameter Max. Units
V
CES
Collector-to-Emitter Voltage 600 V
I
C
@ T
C
= 25°C Contin uous Collecto r Current 60
I
C
@ T
C
= 100°C Contin uous Collecto r Current 34
I
CM
Pulse Collector Cu rrent (Ref. Fig. C. T.4) 1 20
I
LM
Cla m ped Indu ctiv e Load Curr e nt
d
120 A
I
F
@ T
C
= 25 °C Diode Continous Forward Current 40
I
F
@ T
C
= 100°C Diode Continous Forward Current 15
I
FRM
Maximum Rep etit ive Forward Current
e
60
V
GE
Gate-to-Emitter Voltage ±20 V
P
D
@ T
C
= 25°C Maximum Power Dissipati on 308 W
P
D
@ T
C
= 100°C Maximum Power Dissipati on 123
T
J
Operating Junction and -55 to +150
T
STG
Storag e Temperat ure Ra nge °C
Solder ing Tem perat ure for 10 sec. 300 (0.06 3 in. (1.6m m) from case)
Mo unting Torque, 6-32 or M3 Scr ew 10 lbf·in (1.1 N·m)
Thermal Resistanc e Parameter Min. Typ. Max. Units
RθJC (I GBT ) Thermal Resistance Junction-to-Case-(each IGBT) ––– ––– 0.41 °C/W
RθJC (Di ode) Thermal Resistance Junction-to-Case-(each Diode) ––– ––– 1.7
RθCS Thermal Resistance, Case-to-Sink (flat, greased surface) ––– 0.24 –––
RθJA Thermal Resistan ce, Junction-to-Am bient (typical socke t mount) ––– ––– 40
Weight ––– 6.0 (0.21) ––– g (oz)
PD - 94623B
IRGP35B60PD
2www.irf.com
Notes:
RCE(on) typ. = equivalent on-resistance = VCE(on) typ./ IC, where VCE(on) typ.= 1.85V and IC =22A. ID (FET Equivalent) is the equivalent MOSFET ID
rating @ 25°C for applications up to 150kHz. These are provided for comparison purposes (only) with equivalent MOSFET solutions.
VCC = 80% (VCES), VGE = 20V, L = 100 µH, RG = 3.3Ω.
Pulse width limited by max. junction temperature.
Energy losses include "tail" and diode reverse recovery, Data generated with use of Diode 30ETH06.
Coes eff. is a fixed capacitance that gives the same charging time as Coes while VCE is rising from 0 to 80% VCES.
Coes eff.(ER) is a fixed capacitance that stores the same energy as Coes while VCE is rising from 0 to 80% VCES.
Electrical Characteristics @ T
J
= 25°C (unless otherwise speci fied)
Parameter Min. Typ. Max. Units Conditions Ref.Fig
V(BR)CES Collector-to-Emitter Breakdown Voltage 600 — — V VGE = 0V, IC = 500µ A
∆V(BR)CES/∆TJTemperature Coeff. of Breakdown Voltage —0.78—V/°C
VGE = 0V, IC = 1mA (25°C-125°C)
RG Internal Gate Resistance — 1.7 — Ω1MHz, Op en Collector
—1.852.15 IC = 2 2A, VGE = 15V 4, 5,6,8,9
VCE(on) Collect or-to-Em itter Satura tion Volta ge — 2.25 2.55 V IC = 35A , VGE = 15V
—2.372.80 IC = 2 2A, VGE = 15V, TJ = 125°C
—3.003.45 IC = 35A, VGE = 15V, TJ = 125 °C
VGE(th) Gate Threshold Voltage 3.0 4.0 5.0 V IC = 250µ A 7,8,9
∆VGE(th)/∆TJ Thres hold Voltage temp . c oeff i c ient — - 10 — m V / ° C VCE = VGE, IC = 1.0mA
gfe Forward Transconductance — 36 — S VCE = 50V, I C = 22A, PW = 80µs
ICES Coll ec tor -to-E m it t er Lea kage Current — 3.0 37 5 µA VGE = 0V, VCE = 600V
—0.35—mA
VGE = 0V, VCE = 600V, TJ = 125°C
VFM Diode Forward Voltage Drop — 1.30 1.70 V IF = 15A , V GE = 0V 10
—1.201.60 IF = 15A, VGE = 0V, TJ = 125°C
IGES Gate- to-E m it t er Lea kage Current — — ±100 nA VGE = ±20V, VCE = 0 V
Switchi ng Characteri sti cs @ T
J
= 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Ref.Fig
Qg Total Gate Char ge (turn-on) — 160 240 IC = 2 2A 17
Qgc Gate-to-Col lector Char ge (turn-on ) — 55 83 nC VCC = 400V CT1
Qge Gate-to-Emitter Charge (turn-on) — 21 32 VGE = 15V
Eon Turn-On Switching Loss — 220 270 IC = 2 2A, VCC = 390V CT3
Eoff Turn- O ff S witchi ng Loss — 2 15 265 µJ VGE = +15V, RG = 3.3 Ω, L = 200µH
Etotal Total Switchin g Loss — 435 5 35 TJ = 2 5 °C
f
td(on) Turn- On d elay ti me — 26 3 4 IC = 22A, VCC = 390V CT3
trRise ti me — 6.0 8.0 ns VGE = +15V, RG = 3.3Ω, L = 200µH
td(off) Tu rn- Of f de lay t i me — 1 10 122 TJ = 2 5°C
f
tfFall ti m e — 8.0 10
Eon Turn-On Switching Loss — 410 465 IC = 2 2A, VCC = 390V CT3
Eoff Turn- Of f S witchi ng Loss — 3 30 405 µJ VGE = +15V, R G = 3.3 Ω, L = 200µH 11,13
Etotal Total Switchin g Loss — 740 8 70 TJ = 125°C
f
WF1,WF
2
td(on) Turn- On d elay ti me — 26 3 4 IC = 22A, VCC = 390V CT3
trRise ti me — 8.0 11 ns VGE = +15V, R G = 3.3 Ω, L = 200µH 12,14
td(off) Tu rn- Of f de lay t i me — 1 30 150 TJ = 125°C
f
WF1,WF
2
tfFall ti m e — 12 16
Cies Input Capacitance — 3715 — VGE = 0V 16
Coes Out put Ca pacitance — 265 — VCC = 30V
Cres Reverse Transf er Ca paci tance — 47 — p F f = 1Mhz
Coes eff.
Eff ective Out put Ca paci tance (Time Relate d)
g
—135— VGE = 0V, VCE = 0V to 4 80V 15
Coes eff. (ER)
Eff ective Output Capacitance (Ene rgy Re lated)
g
—179— TJ = 150°C, IC = 120A 3
RBSOA Reverse Bias Safe Operating Area FULL SQUARE VCC = 480V, Vp =600V CT2
Rg = 22Ω, VGE = +15V to 0V
trr Diod e Re v ers e R ec ov er y Tim e — 4 2 60 ns TJ = 2 5°C IF = 15A, VR = 200V, 19
—74120 TJ = 125°C di/dt = 200A/µs
Qrr Diod e Re v er s e Rec overy Char g e — 80 180 n C TJ = 2 5 °C IF = 15A, VR = 200V, 21
— 220 600 TJ = 125°C di/dt = 200A/µs
Irr Peak Reverse Recovery Current — 4.0 6.0 A TJ = 25°C IF = 15A, V R = 200V, 19,20,21,22
—6.510 TJ = 125°C di/dt = 200A/µs CT5
Conditions
IRGP35B60PD
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Fig. 1 - Maximum DC Collector Current vs.
Case Temperature Fig. 2 - Power Dissipation vs. Case
Temperature
Fig. 3 - Reverse Bias SOA
TJ = 150°C; VGE =15V Fig. 4 - Typ. IGBT Output Characteristics
TJ = -40°C; tp = 80µs
Fig. 5 - Typ. IGBT Output Characteristics
TJ = 25°C; tp = 80µs Fig. 6 - Typ. IGBT Output Characteristics
TJ = 125°C; tp = 80µs
0 20 40 60 80 100 120 140 160
TC (°C)
0
10
20
30
40
50
60
70
IC (A)
10 100 1000
VCE (V)
1
10
100
1000
IC A)
012345
VCE (V)
0
10
20
30
40
50
60
70
ICE (A)
VGE = 15V
VGE = 12V
VGE = 10V
VGE = 8.0V
VGE = 6.0V
012345
VCE (V)
0
10
20
30
40
50
60
70
ICE (A)
VGE = 15V
VGE = 12V
VGE = 10V
VGE = 8.0V
VGE = 6.0V
012345
VCE (V)
0
10
20
30
40
50
60
70
ICE (A)
VGE = 15V
VGE = 12V
VGE = 10V
VGE = 8.0V
VGE = 6.0V
0 20 40 60 80 100 120 140 160
TC (°C)
0
50
100
150
200
250
300
350
Ptot (W)
IRGP35B60PD
4www.irf.com
Fig. 8 - Typical VCE vs. VGE
TJ = 25°C
Fig. 9 - Typical VCE vs. VGE
TJ = 125°C
Fig. 12 - Typ. Switching Time vs. IC
TJ = 125°C; L = 200µH; VCE = 390V, RG = 3.3Ω; VGE = 15V.
Diode clamp used: 30ETH06 (See C.T.3)
Fig. 11 - Typ. Energy Loss vs. IC
TJ = 125°C; L = 200µH; VCE = 390V, RG = 3.3Ω; VGE = 15V.
Diode clamp used: 30ETH06 (See C.T.3)
Fig. 10 - Typ. Diode Forward Characteristics
tp = 80µs
Fig. 7 - Typ. Transfer Characteristics
VCE = 50V; tp = 10µs
0 5 10 15 20
VGE (V)
0
100
200
300
400
500
600
700
800
ICE (A)
TJ = 25°C
TJ = 125°C
TJ = 125°C
TJ = 25°C
0 5 10 15 20
VGE (V)
1
2
3
4
5
6
7
8
9
10
VCE (V)
ICE = 11A
ICE = 22A
ICE = 35A
0 5 10 15 20
VGE (V)
1
2
3
4
5
6
7
8
9
10
VCE (V)
ICE = 11A
ICE = 22A
ICE = 35A
0 5 10 15 20 25 30 35 40
IC (A)
0
100
200
300
400
500
600
700
800
Energy (µJ)
EOFF
EON
010 20 30 40
IC (A)
1
10
100
1000
Swiching Time (ns)
tR
tdOFF
tF
tdON
1
10
100
0.8 1.2 1.6 2.0 2.4
FM
F
Instantaneous Forward Cu rre n t - I (A)
Forward Voltage Drop - V (V)
T = 150 ° C
T = 125 ° C
T = 25°C
J
J
J
IRGP35B60PD
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Fig. 14 - Typ. Switching Time vs. R G
TJ = 125°C; L = 200µH; VCE = 390V, ICE = 22A; VGE = 15V
Diode clamp used: 30ETH06 (See C.T.3)
Fig. 13 - Typ. Energy Loss vs. RG
TJ = 125°C; L = 200µH; VCE = 390V, ICE = 22A; VGE = 15V
Diode clamp used: 30ETH06 (See C.T.3)
Fig. 16- Typ. Capacitance vs. VCE
VGE= 0V; f = 1MHz
Fig. 15- Typ. Output Capacitance
Stored Energy vs. VCE
Fig. 17 - Typical Gate Charge vs. VGE
ICE = 22A Fig. 18 - Normalized Typ. VCE(on)
vs. Junction Temperature
IC = 22A, V GE= 15V
-50 0 50 100 150 200
TJ (°C)
0.8
1.0
1.2
1.4
Normalized VCE(on) (V)
010 20 30 40 50
RG (Ω)
0
100
200
300
400
500
600
700
800
Energy (µJ)
EON
EOFF
010 20 30 40 50
RG (Ω)
1
10
100
1000
Swiching Time (ns)
tR
tdOFF
tF
tdON
020 40 60 80 100
VCE (V)
10
100
1000
10000
Capacitance (pF)
Cies
Coes
Cres
0 50 100 150 200
Q G, Total Gate Charge (nC)
0
2
4
6
8
10
12
14
16
VGE (V)
400V
0 100 200 300 400 500 600 700
VCE (V)
0
5
10
15
20
25
30
Eoes (µJ)
IRGP35B60PD
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Fig. 20 - Typical Recovery Current vs. dif/dt
Fig. 19 - Typical Reverse Recovery vs. dif/dt
Fig. 21 - Typical Stored Charge vs. dif/dt Fig. 22 - Typical di(rec)M/dt vs. dif/dt,
20
40
60
80
100
100 1000
f
d i /dt - (A/µs)
t - (ns)
rr
I = 30A
I = 15A
I = 5.0A
F
F
F
V = 200V
T = 125°C
T = 25 °C
R
J
J
1
10
100
100 1000
f
di /dt - (A/µs)
I - (A)
IRRM
I = 5.0A
I = 15A
I = 30A
F
F
F
V = 200V
T = 125°C
T = 25 °C
R
J
J
0
200
400
600
800
100 1000
f
d i /dt - (A/µs)
RR
Q - (nC)
I = 30A
I = 15A
I = 5. 0 A
F
F
F
V = 200V
T = 125°C
T = 25°C
R
J
J
100
1000
100 1000
f
di /dt - (A/µs)
di(re c)M/dt - (A/µs)
I = 5. 0 A
I = 15A
I = 30A
F
F
F
V = 200V
T = 125°C
T = 25 °C
R
J
J
IRGP35B60PD
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Fig. 24. Maximum Transient Thermal Impedance, Junction-to-Case (DIODE)
Fig 23. Maximum Transient Thermal Impedance, Junction-to-Case (IGBT)
1E-006 1E-005 0.0001 0.001 0.01 0.1 1
t1 , Rectangular P ulse Duration ( s ec)
0.001
0.01
0.1
1
10
Thermal Response ( Z thJC )
0.20
0.10
D = 0.50
0.02
0.01
0.05
SINGLE PULSE
( THERMAL RESPONSE )
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + T c
Ri (°C/W) τi (sec)
0.363 0.000112
0.864 0.001184
0.473 0.032264
τJ
τJ
τ1
τ1τ2
τ2τ3
τ3
R1
R1R2
R2R3
R3
τ
τ
C
Ci= i/Ri
Ci= τi/Ri
1E-006 1E-005 0.0001 0.001 0.01 0.1
t1 , Rect angular P ulse Dur ation ( sec)
0.0001
0.001
0.01
0.1
1
Thermal Response ( Z thJC )
0.20
0.10
D = 0.50
0.02
0.01
0.05
SINGLE PULSE
( THERMAL RESPONSE ) Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthj c + Tc
Ri (°C/W) τi (sec)
0.139 0.000257
0.077 0.001418
0.194 0.020178
τJ
τJ
τ1
τ1τ2
τ2τ3
τ3
R1
R1R2
R2R3
R3
τ
τ
C
Ci= i/Ri
Ci= τi/Ri
IRGP35B60PD
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Fig.C.T.1 - Gate Charge Circuit (turn-off) Fig.C.T.2 - RBSOA Circuit
L
Rg
80 V DUT
480V
1K
VCC
DUT
0
L
Fig.C.T.4 - Resistive Load Circuit
Rg
VCC
DUT
R =
V
CC
I
CM
Fig.C.T.3 - Switching Loss Circuit
Fig. C.T.5 - Reverse Recovery Parameter
Test Circuit
REVERSE RECOVERY CIRCUIT
IRFP250
D.U.T.
L = 70µH
V = 200V
R
0.01
Ω
G
D
S
dif/dt
ADJUST
P
FC diode L
Rg
VC
C
DUT /
DRIVER
IRGP35B60PD
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Fig. WF1 - Typ. Turn-off Loss Waveform
@ TJ = 25°C using Fig. CT.3 Fig. WF2 - Typ. Turn-on Loss Waveform
@ TJ = 25°C using Fig. CT.3
Fig. WF3 - Reverse Recovery Waveform and
Definitions
4. Qrr - Area under curve defined by trr
and IRRM
trr X IRRM
Qrr =
2
5. di(rec)M/dt - Peak rate of change of
current during tb portion of trr
t
a
t
b
t
rr
Q
rr
I
F
I
RRM
I
RRM
0.5
di(rec)M/dt
0.75 I
RRM
5
4
3
2
0
1
di /dt
f
1. dif/dt - Rate of change of current
through zero crossing
2. IRRM - Peak reverse recovery current
3. trr - Reverse recovery time measured
from zero crossing point of negative
going IF to point where a line passing
through 0.75 IRRM and 0.50 IRRM
extrapolated to zero current
-50
0
50
100
150
200
250
300
350
400
450
9.00 9.20 9.40 9.60
Time (µs)
V
CE
(V)
-5
0
5
10
15
20
25
30
35
40
45
I
CE
(A)
TEST CURRENT
90% test current
5% V
CE
10% test current
E o n Lo ss
tr
-50
0
50
100
150
200
250
300
350
400
450
-0.20 0.00 0.20 0.40 0.60 0.80
Time(µs)
V
CE
(V)
-5
0
5
10
15
20
25
30
35
40
45
I
CE
(A)
90% ICE
5% VCE
5% ICE
Eoff Loss
tf
IRGP35B60PD
10 www.irf.com
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information. 08/04
Data and specifications subject to change without notice.
This product has been designed and qualified for Industrial market.
Qualification Standards can be found on IR’s Web site.
TO-247AC Package Outline Dimensions are shown in millimeters (inches)
TO-247AC Part Marking Information
EXAMPLE:
ASSEMBLED ON WW 35, 2000
LOT CO DE 5657
WIT H ASSE MBLY
THIS IS AN IRFPE30
IN THE ASSEMBLY LI NE "H " 035H
LOGO
INTERNATIONAL
RECTIFIER IRFPE30
LOT CODE
ASSEMBLY
56 57
P ART N U MBER
DATE CODE
YEAR 0 = 200
0
WEE K 35
LINE H
Note: "P" in assembly line
position indicates "Le ad-Fr ee"
Note: For the most current drawings please refer to the IR website at:
http://www.irf.com/package/
