LBA110L Dual Single-Pole, Combination OptoMOS(R) Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Ratings 350 120 35 Units VP mArms / mADC Features * * * * * * * * * * * 3750Vrms Input/Output Isolation Normally Open Relay is a Current-Limiting Device Low Drive Power Requirements High Reliability Arc-Free With No Snubbing Circuits FCC Compatible VDE Compatible No EMI/RFI Generation Small 8-Pin Package Flammability Rating UL 94 V-0 Surface Mount Tape & Reel Versions Available Applications * Telecommunications * Telecom Switching * Tip/Ring Circuits * Modem Switching (Laptop, Notebook, Pocket Size) * Hook Switch * Dial Pulsing * Ground Start * Ringing Injection * Instrumentation * Multiplexers * Data Acquisition * Electronic Switching * I/O Subsystems * Meters (Watt-Hour, Water, Gas) * Medical Equipment-Patient/Equipment Isolation * Security * Aerospace * Industrial Controls Description LBA110L is a combination device comprising one normally open (1-Form-A) and one normally closed (1-Form-B) solid state relays. Both relays are independent, 350V, 120mA, 35 devices designed to provide an ideal solution where a complementary relay pair (1-Form-A / 1-Form-B) is required. The normally open (1-Form-A) relay is configured as a current-limiting device. Approvals * UL Recognized Component: File E76270 * CSA Certified Component: Certificate 1175739 * EN/IEC 60950-1 Certified Component: Certificate available on our website Ordering Information Part # LBA110L LBA110PL Description 8-Pin DIP (50/Tube) 8-Pin Flatpack (50/Tube) LBA110PLTR 8-Pin Flatpack (1000/Reel) LBA110LS 8-Pin Surface Mount (50/Tube) LBA110LSTR 8-Pin Surface Mount (1,000/Reel) Pin Configuration + Control - Normally Closed - Control - Normally Closed + Control - Normally Open - Control - Normally Open 1 8 2 7 3 6 4 5 Switching Characteristics of Normally Open (Form A) Devices Form-B IF IF ILOAD 90% 10% ton DS-LBA110L-R07 www.ixysic.com Normally Open Pole Switching Characteristics of Normally Closed (Form B) Devices Form-A ILOAD Normally Closed Pole toff 10% toff 90% ton 1 INTEGRATED CIRCUITS DIVISION LBA110L Absolute Maximum Ratings @ 25C Parameter Ratings Blocking Voltage 350 Reverse Input Voltage 5 Input Control Current 50 Peak (10ms) 1 1 Input Power Dissipation 150 800 Total Power Dissipation 2 Isolation Voltage, Input to Output 3750 Operational Temperature -40 to +85 Storage Temperature -40 to +125 1 2 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms C C Typical values are characteristic of the device at +25C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 1.33 mW / C Derate linearly 6.67 mW / C Electrical Characteristics @ 25C Parameter Output Characteristics Load Current Continuous 1 Peak (1-Form-B Relay Only) Load Current Limiting (1-Form-A Relay Only) On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 1 2 2 Conditions Symbol Min Typ Max Units t =10ms IL=120mA VL=350VP IL ILPK ICL RON ILEAK 130 - 170 23 - 120 350 210 35 1 mArms / mADC mAP mA VL=50V, f=1MHz ton toff COUT - 25 3 3 - IL=120mA IF=5mA VR=5V IF VF IR 0.4 0.9 - 0.7 1.2 - 5 1.5 10 mA mA V A VIO=0V, f=1MHz CIO - 3 - pF IF=5mA, VL=10V A ms pF If both poles operate, then the load current must be derated so as not to exceed the package power dissipation value. Measurement taken within one (1) second of on-time. www.ixysic.com R07 INTEGRATED CIRCUITS DIVISION LBA110L Form-A/Form-B PERFORMANCE DATA* Device Count (N) 30 25 20 15 10 5 0 1.17 1.8 0.030 1.6 0.025 1.4 IF=50mA IF=30mA IF=20mA IF=10mA IF=5mA 1.2 1.0 0.020 0.015 0.010 0.005 0.8 -40 1.19 1.21 1.23 1.25 LED Forward Voltage Drop (V) Typical Leakage vs. Temperature Measured Across Pins 5&6 or 7&8 Leakage (PA) LED Forward Voltage Drop (V) 35 Typical LED Forward Voltage Drop vs. Temperature Typical LED Forward Voltage Drop (N=50, IF=5mA) -20 0 20 40 60 80 Temperature (C) 100 0 -40 120 -20 0 20 40 60 80 100 Temperature (C) Form-A RELAY PERFORMANCE DATA* Form-A Typical Turn-On Time (N=50, IF=5mA, IL=120mADC) 25 15 10 5 0 15 10 5 0.65 20 25 15 10 5 0.08 0.13 0.18 Turn-Off Time (ms) 0.5 0.7 0.9 1.1 1.3 LED Current (mA) 1.5 15 10 0.23 15.8 16.1 16.4 16.7 17.0 17.3 On-Resistance (:) 17.6 Form-A Typical Blocking Voltage Distribution (N=50) Form-A Typical IF for Switch Dropout (N=50, IL=120mADC) 35 30 20 15 10 5 25 20 15 10 5 0 0 20 0 0.03 Form-A Typical IF for Switch Operation (N=50, IL=120mADC) 25 5 Device Count (N) 0.35 0.45 0.55 Turn-On Time (ms) Device Count (N) Device Count (N) 0.25 Form-A Typical On-Resistance Distribution (N=50, IF=5mA, IL=120mADC) 30 20 0 0.15 25 35 Device Count (N) 20 Device Count (N) Device Count (N) 25 Form-A Typical Turn-Off Time (N=50, IF=5mA, IL=120mADC) 0 0.15 0.45 0.75 1.05 1.35 LED Current (mA) 1.65 1.95 376.8 378.3 379.8 381.3 382.8 384.3 385.8 Blocking Voltage (VP) *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. R07 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION LBA110L Form-A PERFORMANCE DATA* FormA Typical Turn-On Time vs. LED Forward Current (IL=120mADC) 0.092 20 0.25 0.20 0.15 0.088 On-Resistance (:) 0.30 0.086 0.084 0.082 0.080 0.078 10 15 20 25 30 35 40 LED Forward Current (mA) 45 0 50 Form-A Typical Turn-On Time vs. Temperature (IL=120mADC) 0.50 0.45 0.40 Turn-Off TIme (ms) IF=5mA IF=10mA 0.35 0.30 0.25 IF=20mA 0.20 0.15 -40 -20 0 20 40 60 Temperature (C) 80 10 15 20 25 30 35 40 LED Forward Current (mA) 0.20 0.18 0.16 0.14 0.12 0.10 0.08 0.06 0.04 0.02 0 12 -40 -20 0 20 40 60 Temperature (C) 80 100 Form A Maximum Load Current vs. Temperature 180 160 140 120 100 IF=20mA IF=10mA IF=5mA 80 60 40 20 0 -40 100 14 50 45 Form-A Typical Turn-Off Time vs. Temperature (IF=5mA, IL=120mADC) -20 0 20 40 60 Temperature (C) 80 -40 100 Form-A Typical IF for Switch Dropout vs. Temperature (IL=120mADC) Form-A Typical IF for Switch Operation vs. Temperature (IL=120mADC) 2.5 5 Load Current (mA) 5 16 8 0.074 0 18 10 0.076 0.10 Turn-On Time (ms) Form-A Typical On-Resistance vs. Temperature (IF=5mA, IL=120mADC) 0.090 0.35 Turn-Off Time (ms) Turn-On Time (ms) 0.40 Form-A Typical Turn-Off Time vs. LED Forward Current (IL=120mADC) -20 0 20 40 60 80 Temperature (C) 100 120 80 100 Form-A Typical Blocking Voltage vs. Temperature 400 2.5 1.5 1.0 0.5 Blocking Voltage (VP) LED Current (mA) LED Current (mA) 395 2.0 2.0 1.5 1.0 0.5 390 385 380 375 370 365 360 0 355 0 -20 0 20 40 60 Temperature (C) Load Current (mA) 150 80 100 -40 -20 0 20 40 60 Temperature (C) 100 50 0 -50 -100 -150 -2.0 80 100 -40 -20 0 20 40 60 Temperature (C) Form-A Typical Current Limiting Characteristics vs. Temperature (IF=5mA) Form-A Typical Load Current vs. Load Voltage (IF=5mA) 250 Current Limit (mA) -40 200 150 100 50 0 -1.5 -1.0 -0.5 0 0.5 1.0 Load Voltage (V) 1.5 2.0 -40 -20 0 20 40 60 Temperature (C) 80 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R07 INTEGRATED CIRCUITS DIVISION LBA110L Form-B PERFORMANCE DATA* Form-B Typical Turn-On Time (N=50, IF=5mA, IL=120mADC) 30 30 30 15 10 20 15 10 5 5 0 0 0.14 0.18 0.22 0.26 Turn-On Time (ms) 30 0.25 Device Count (N) 20 15 10 5 0.35 0.45 0.55 0.65 Turn-Off Time (ms) 27.8 0.7 1.1 1.3 1.5 LED Current (mA) 15 10 5 0.55 0.65 0.75 LED Current (mA) 0.85 386.3 388.8 391.3 393.8 396.3 398.8 401.3 Blocking Voltage (VP) Form-B Typical Turn-Off Time vs. LED Forward Current (IL=120mADC) Form-B Typical On-Resistance vs. Temperature (IF=5mA, IL=120mADC) 60 0.5 0.4 0.3 0.2 10 15 20 25 30 35 40 LED Forward Current (mA) 45 0 50 FormB Typical Turn-On Time vs. Temperature (IF=5mA, IL=120mADC) 0.35 Turn-Off Time (ms) Turn-On Time (ms) 0.25 0.20 0.15 0.10 20 40 60 Temperature (C) 80 100 -40 -20 0 20 40 60 Temperature (C) 80 100 180 160 IF=10mA 0.3 IF=20mA 0.1 20 Form-B Maximum Load Current vs. Temperature (IF=5mA) IF=5mA 0.4 0 30 50 0.5 0.2 0 45 Form-B Typical Turn-Off Time vs. Temperature (IL=120mADC) 0.6 0.05 -20 10 15 20 25 30 35 40 LED Forward Current (mA) 0.7 0.30 -40 5 Load Current (mA) 5 40 0 0 0 50 10 0.1 0.05 10 0.95 On-Resistance (:) Turn-Off Time (ms) Turn-On Time (ms) 0.10 15 0 0.45 0.6 0.15 20 5 0.7 0.20 32.0 25 0.35 0.25 29.2 29.9 30.6 31.3 On-Resistance (:) 30 20 1.9 Form-B Typical Turn-On Time vs. LED Forward Current (IL=120mADC) 28.5 Form-B Typical Blocking Voltage Distribution (N=50) 0 0 10 0.75 Form-B Typical IF for Switch Dropout (N=50, IL=120mADC) 25 25 15 0 0.30 Form-B Typical IF for Switch Operation (N=50, IL=120mADC) 20 5 Device Count (N) 0.10 Device Count (N) 20 Form-B Typical On-Resistance Distribution (N=50, IF=5mA, IL=120mADC) 25 25 Device Count (N) Device Count (N) 25 Device Count (N) Form-B Typical Turn-Off Time (N=50, IF=5mA, IL=120mADC) 140 120 100 80 60 40 20 0 -40 -20 0 20 40 60 Temperature (C) 80 100 -40 -20 0 20 40 60 80 Temperature (C) 100 120 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. R07 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION LBA110L Form-B PERFORMANCE DATA* Form-B Typical IF for Switch Operation vs. Temperature (IL=120mADC) 3.0 3.0 Form-B Typical Blocking Voltage vs. Temperature LED Current (mA) 2.0 1.5 1.0 Blocking Voltage (VP) 2.5 2.5 LED Current (mA) Form-B Typical IF for Switch Dropout vs. Temperature (IL=120mADC) 2.0 1.5 1.0 0.5 0.5 0 0 -40 -20 0 20 40 60 Temperature (C) 80 100 -40 -20 0 20 40 60 Temperature (C) Form-B Typical Load Current vs. Load Voltage (IF=5mA) Load Current (A) Load Current (mA) 100 0 -50 -100 -150 -4 -3 -2 -1 0 1 Load Voltage (V) 2 3 4 100 -40 -20 0 20 40 60 Temperature (C) 80 100 Form-B Energy Rating Curve 150 50 80 410 405 400 395 390 385 380 375 370 365 360 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10Ps 100Ps 1ms 10ms 100ms Time 1s 10s 100s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. 6 www.ixysic.com R07 INTEGRATED CIRCUITS DIVISION LBA110L Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification LBA110L / LBA110LS / LBA110PL MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)C or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classification Temperature (Tc) Dwell Time (tp) Max Reflow Cycles LBA110L LBA110LS LBA110PL 250C 250C 260C 30 seconds 30 seconds 30 seconds 1 3 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. R07 www.ixysic.com 7 INTEGRATED CIRCUITS DIVISION LBA110L MECHANICAL DIMENSIONS LBA110L 2.540 0.127 (0.100 0.005) 9.652 0.381 (0.380 0.015) 8-0.800 DIA. (8-0.031 DIA.) 2.540 0.127 (0.100 0.005) 9.144 0.508 (0.360 0.020) 6.350 0.127 (0.250 0.005) Pin 1 PCB Hole Pattern 7.620 0.254 (0.300 0.010) 3.302 0.051 (0.130 0.002) 0.457 0.076 (0.018 0.003) 7.620 0.127 (0.300 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 7.620 0.127 (0.300 0.005) 0.254 0.0127 (0.010 0.0005) Dimensions mm (inches) 0.813 0.102 (0.032 0.004) LBA110LS 9.652 0.381 (0.380 0.015) 2.540 0.127 (0.100 0.005) 6.350 0.127 (0.250 0.005) Pin 1 0.635 0.127 (0.025 0.005) 3.302 0.051 (0.130 0.002) 9.525 0.254 (0.375 0.010) 0.457 0.076 (0.018 0.003) PCB Land Pattern 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 0.254 (0.300 0.010) 0.254 0.0127 (0.010 0.0005) 0.65 (0.0255) 4.445 0.127 (0.175 0.005) Dimensions mm (inches) 0.813 0.102 (0.032 0.004) LBA110PL 2.540 0.127 (0.100 0.005) 6.350 0.127 (0.250 0.005) 0 MIN / 0.102 MAX (0 MIN / 0.004 MAX) 9.398 0.127 (0.370 0.005) Pin 1 9.652 0.381 (0.380 0.015) 7.620 0.254 (0.300 0.010) 2.286 MAX. (0.090 MAX.) 2.54 (0.10) 0.635 0.127 (0.025 0.005) 0.203 0.013 (0.008 0.0005) 8.70 (0.3425) 1.55 (0.0610) 0.65 (0.0255) 2.159 0.025 (0.085 0.001) 0.457 0.076 (0.018 0.003) 0.864 0.120 (0.034 0.004) 8 PCB Land Pattern Dimensions mm (inches) www.ixysic.com R07 INTEGRATED CIRCUITS DIVISION LBA110L MECHANICAL DIMENSIONS LBA110LSTR Tape & Reel 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) W=16.00 (0.63) Bo=10.30 (0.406) K0 =4.90 (0.193) Ao=10.30 (0.406) K1 =4.20 (0.165) Embossed Carrier Embossment P1=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all "Notes" for constant dimensions listed on page 5 of EIA-481-2 LBA110PLTR Tape & Reel 2.00 (0.079) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) Embossment W = 16.00 (0.63) 7.50 (0.295) Bo = 10.30 (0.406) K0 = 2.70 (0.106) K1 = 2.00 (0.079) Embossed Carrier 4.00 (0.157) Ao = 10.30 (0.406) P1 = 12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all "Notes" for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits' Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice. 9 Specification: DS-LBA110L-R07 (c)Copyright 2018, IXYS Integrated Circuits OptoMOS(R) is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 6/25/2018